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1. 
Cover image for Inkjet-Configurable Gate Array Towards Application Specific Printed Electronic Circuits
Inkjet-Configurable Gate Array Towards Application Specific Printed Electronic Circuits
Author 
Mashayekhi, Mohammad. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-72116-3
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2. 
Cover image for Mechatronic Systems Analysis, Design and Implementation
Mechatronic Systems Analysis, Design and Implementation
Author 
Boukas, El-Kébir. author. AL-Sunni, Fouad M. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-22324-2
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3. 
Cover image for Introduction to Mixed-Signal, Embedded Design
Introduction to Mixed-Signal, Embedded Design
Author 
Doboli, Alex. author. Currie, Edward H. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-7446-4
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4. 
Cover image for ECODESIGN -- The Competitive Advantage
ECODESIGN -- The Competitive Advantage
Author 
Wimmer, Wolfgang. author. Lee, Kun-Mo. author. Quella, Ferdinand. author. Polak, John. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-90-481-9127-7
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5. 
Cover image for Real-time Iterative Learning Control Design and Applications
Real-time Iterative Learning Control Design and Applications
Author 
Xu, Jian-Xin. author. Panda, Sanjib K. author. Lee, Tong Heng. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-84882-175-0
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6. 
Cover image for Assistive Technology for Visually Impaired and Blind People
Assistive Technology for Visually Impaired and Blind People
Author 
Hersh, Marion A. editor. Johnson, Michael A. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-84628-867-8
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7. 
Cover image for Adaptive Structural Systems with Piezoelectric Transducer Circuitry
Adaptive Structural Systems with Piezoelectric Transducer Circuitry
Author 
Tang, Jiong. author. Wang, Kon-Well. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-78751-0
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8. 
Cover image for Elektromagnete Grundlagen, Berechnung, Entwurf und Anwendung
Elektromagnete Grundlagen, Berechnung, Entwurf und Anwendung
Author 
Kallenbach, Eberhard. author. Eick, Rüdiger. author. Quendt, Peer. author. Ströhla, Tom. author. Feindt, Karsten. author.
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http://dx.doi.org/10.1007/978-3-8351-9241-6
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9. 
Cover image for Precision Manufacturing
Precision Manufacturing
Author 
Dornfeld, David. author. Lee, Dae-Eun. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-68208-2
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10. 
Cover image for Optimal Production Planning for PCB Assembly
Optimal Production Planning for PCB Assembly
Author 
Ho, William. author. Ji, Ping. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-84628-500-4
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11. 
Cover image for Integrated Circuit Packaging, Assembly and Interconnections
Integrated Circuit Packaging, Assembly and Interconnections
Author 
Greig, William J. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/0-387-33913-2
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12. 
Cover image for Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Author 
Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/0-387-32989-7
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