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1. 
Cover image for Advanced Materials Science & Technology in China: A Roadmap to 2050
Advanced Materials Science & Technology in China: A Roadmap to 2050
Author 
Lu, Ke. editor. Chen, Lidong. editor. He, Tianbai. editor. Yan, Qing. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-05318-4
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2. 
Cover image for Nanoscience and Engineering in Superconductivity
Nanoscience and Engineering in Superconductivity
Author 
Moshchalkov, Victor. editor. Woerdenweber, Roger. editor. Lang, Wolfgang. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-15137-8
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3. 
Cover image for Introduction to the Physics of Diluted Magnetic Semiconductors
Introduction to the Physics of Diluted Magnetic Semiconductors
Author 
Gaj, Jan A. editor. Kossut, Jacek. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-15856-8
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4. 
Cover image for POWER/HVMOS Devices Compact Modeling
POWER/HVMOS Devices Compact Modeling
Author 
Grabinski, Wladyslaw. editor. Gneiting, Thomas. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-90-481-3046-7
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5. 
Cover image for Variation Aware Analog and Mixed-Signal Circuit Design in Emerging Multi-Gate CMOS Technologies
Variation Aware Analog and Mixed-Signal Circuit Design in Emerging Multi-Gate CMOS Technologies
Author 
Fulde, Michael. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-90-481-3280-5
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6. 
Cover image for Electrical Conductive Adhesives with Nanotechnologies
Electrical Conductive Adhesives with Nanotechnologies
Author 
Li, Yi. author. Lu, Daniel. author. Wong, C. P. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-88783-8
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7. 
Cover image for Strain Effect in Semiconductors Theory and Device Applications
Strain Effect in Semiconductors Theory and Device Applications
Author 
Sun, Yongke. author. Thompson, Scott E. author. Nishida, Toshikazu. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-0552-9
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8. 
Cover image for Metamaterials Theory, Design, and Applications
Metamaterials Theory, Design, and Applications
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Cui, Tie Jun. editor. Smith, David. editor. Liu, Ruopeng. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-0573-4
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9. 
Cover image for Fiberglass and Glass Technology Energy-Friendly Compositions and Applications
Fiberglass and Glass Technology Energy-Friendly Compositions and Applications
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Wallenberger, Frederick T. editor. Bingham, Paul A. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-0736-3
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10. 
Cover image for Three Dimensional Integrated Circuit Design EDA, Design and Microarchitectures
Three Dimensional Integrated Circuit Design EDA, Design and Microarchitectures
Author 
Xie, Yuan. editor. Cong, Jason. editor. Sapatnekar, Sachin. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-0784-4
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11. 
Cover image for Cellular Nanoscale Sensory Wave Computing
Cellular Nanoscale Sensory Wave Computing
Author 
Baatar, Chagaan. editor. Porod, Wolfgang. editor. Roska, Tamás. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-1011-0
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12. 
Cover image for Device Physics of Narrow Gap Semiconductors
Device Physics of Narrow Gap Semiconductors
Author 
Chu, Junhao. author. Sher, Arden. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-1040-0
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