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1. 
Cover image for Wire Ropes Tension, Endurance, Reliability
Wire Ropes Tension, Endurance, Reliability
Author 
Feyrer, K. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-33831-4
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2. 
Cover image for Auswuchttechnik
Auswuchttechnik
Author 
Schneider, Hatto. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-49092-0
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3. 
Cover image for Reliability Engineering Theory and Practice
Reliability Engineering Theory and Practice
Author 
Birolini, Alessandro. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-49390-7
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4. 
Cover image for Manufacturing Execution Systems — MES
Manufacturing Execution Systems — MES
Author 
Kletti, Jürgen. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-49744-8
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5. 
Cover image for Design for Six Sigma+Lean Toolset Innovationen erfolgreich realisieren
Design for Six Sigma+Lean Toolset Innovationen erfolgreich realisieren
Author 
Mollenhauer, Jens-Peter. author. Staudter, Christian. author. Meran, Renata. author. Hamalides, Alexis. author. Roenpage, Olin. author.
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http://dx.doi.org/10.1007/978-3-540-69772-5
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6. 
Cover image for Management by Measurement Designing Key Indicators and Performance Measurement Systems
Management by Measurement Designing Key Indicators and Performance Measurement Systems
Author 
Franceschini, Fiorenzo. author. Galetto, Maurizio. author. Maisano, Domenico. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-73212-9
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7. 
Cover image for Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Author 
Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/0-387-32989-7
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8. 
Cover image for Lead-Free Electronic Solders A Special Issue of the Journal of Materials Science: Materials in Electronics
Lead-Free Electronic Solders A Special Issue of the Journal of Materials Science: Materials in Electronics
Author 
Subramanian, K. N. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-48433-4
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9. 
Cover image for Reliability, Life Testing and the Prediction of Service Lives For Engineers and Scientists
Reliability, Life Testing and the Prediction of Service Lives For Engineers and Scientists
Author 
Saunders, Sam C. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-48538-6
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10. 
Cover image for Solder Joint Technology Materials, Properties, and Reliability
Solder Joint Technology Materials, Properties, and Reliability
Author 
Tu, King-Ning. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-38892-2
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11. 
Cover image for Ultrasonic Nondestructive Evaluation Systems Models and Measurements
Ultrasonic Nondestructive Evaluation Systems Models and Measurements
Author 
Schmerr, Lester W. author. Song, Sung-Jin. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-49063-2
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12. 
Cover image for The Statistical Analysis of Recurrent Events
The Statistical Analysis of Recurrent Events
Author 
Cook, Richard J. author. Lawless, Jerald F. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-69810-6
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