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1. 
Cover image for New Directions in Thin Film Nanophotonics
New Directions in Thin Film Nanophotonics
Author 
K. V., Sreekanth. author. ElKabbash, Mohamed. author. Caligiuri, Vincenzo. author. Singh, Ranjan. author. De Luca, Antonio. author.
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https://doi.org/10.1007/978-981-13-8891-0
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2. 
Cover image for Mechanics of Additive and Advanced Manufacturing, Volume 9 Proceedings of the 2017 Annual Conference on Experimental and Applied Mechanics
Mechanics of Additive and Advanced Manufacturing, Volume 9 Proceedings of the 2017 Annual Conference on Experimental and Applied Mechanics
Author 
Wang, Junlan. editor. Antoun, Bonnie. editor. Brown, Eric. editor. Chen, Weinong. editor. Chasiotis, Ioannis. editor.
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https://doi.org/10.1007/978-3-319-62834-9
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3. 
Cover image for Unified Strength Theory and Its Applications
Unified Strength Theory and Its Applications
Author 
Yu, Mao-Hong. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-10-6247-6
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4. 
Cover image for Micromechanics of Materials, with Applications
Micromechanics of Materials, with Applications
Author 
Kachanov, Mark. author. Sevostianov, Igor. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-76204-3
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5. 
Cover image for Advances in Materials Processing Proceedings of Chinese Materials Conference 2017
Advances in Materials Processing Proceedings of Chinese Materials Conference 2017
Author 
Han, Yafang. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-13-0107-0
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6. 
Cover image for Fracture Mechanics With an Introduction to Micromechanics
Fracture Mechanics With an Introduction to Micromechanics
Author 
Gross, Dietmar. author. Seelig, Thomas. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-71090-7
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7. 
Cover image for Head Injury Simulation in Road Traffic Accidents
Head Injury Simulation in Road Traffic Accidents
Author 
Fernandes, Fábio A. O. author. Alves de Sousa, Ricardo J. author. Ptak, Mariusz. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-89926-8
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8. 
Cover image for Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
Author 
Seok, Seonho. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-77872-3
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9. 
Cover image for Basics of Continuum Plasticity
Basics of Continuum Plasticity
Author 
Chung, Kwansoo. author. Lee, Myoung-Gyu. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-10-8306-8
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10. 
Cover image for Strain-Hardening Cement-Based Composites SHCC4
Strain-Hardening Cement-Based Composites SHCC4
Author 
Mechtcherine, Viktor. editor. Slowik, Volker. editor. Kabele, Petr. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-94-024-1194-2
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11. 
Cover image for Engineering Applications for New Materials and Technologies
Engineering Applications for New Materials and Technologies
Author 
Öchsner, Andreas. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-72697-7
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12. 
Cover image for Mechanisms of Cracking and Debonding in Asphalt and Composite Pavements State-of-the-Art of the RILEM TC 241-MCD
Mechanisms of Cracking and Debonding in Asphalt and Composite Pavements State-of-the-Art of the RILEM TC 241-MCD
Author 
Buttlar, William G. editor. Chabot, Armelle. editor. Dave, Eshan V. editor. Petit, Christophe. editor. Tebaldi, Gabriele. editor.
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https://doi.org/10.1007/978-3-319-76849-6
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