Title:
Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect
Author:
Cheng, Jie. author.
ISBN:
9789811061653
Edition:
1st ed. 2018.
Physical Description:
XVIII, 137 p. 103 illus. online resource.
Series:
Springer Theses, Recognizing Outstanding Ph.D. Research,
Added Corporate Author:
Electronic Access:
https://doi.org/10.1007/978-981-10-6165-3Copies:
Available:*
Library | Material Type | Item Barcode | Shelf Number | Status | Item Holds |
|---|---|---|---|---|---|
Searching... | E-Book | 401399-1001 | ONLINE | Searching... | Searching... |