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Cover image for Designing TSVs for 3D Integrated Circuits
Title:
Designing TSVs for 3D Integrated Circuits
Author:
Khan, Nauman. author.
ISBN:
9781461455080
Physical Description:
X, 76 p. 34 illus., 29 illus. in color. online resource.
Series:
SpringerBriefs in Electrical and Computer Engineering,
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E-Book 331791-1001 ONLINE(331791.1)
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