Title:
Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs
Author:
Noia, Brandon. author.
ISBN:
9783319023786
Edition:
1st ed. 2014.
Physical Description:
XVIII, 245 p. 133 illus., 115 illus. in color. online resource.
Added Author:
Added Corporate Author:
Electronic Access:
https://doi.org/10.1007/978-3-319-02378-6Copies:
Available:*
Library | Material Type | Item Barcode | Shelf Number | Status | Item Holds |
|---|---|---|---|---|---|
Searching... | E-Book | 487405-1001 | ONLINE | Searching... | Searching... |