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1. 
Cover image for Flexible Electronics Materials and Applications
Flexible Electronics Materials and Applications
Author 
Salleo, Alberto. editor. Wong, William S. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-74363-9
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2. 
Cover image for Molecular Electronics Materials, Devices and Applications
Molecular Electronics Materials, Devices and Applications
Author 
Jalabert, Antoine. author. Amara, Amara. author. Clermidy, Fabien. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4020-8594-9
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3. 
Cover image for Lead-Free Electronic Solders A Special Issue of the Journal of Materials Science: Materials in Electronics
Lead-Free Electronic Solders A Special Issue of the Journal of Materials Science: Materials in Electronics
Author 
Subramanian, K. N. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-48433-4
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4. 
Cover image for Intelligent Robotics and Applications 16th International Conference, ICIRA 2023, Hangzhou, China, July 5-7, 2023, Proceedings, Part IV
Intelligent Robotics and Applications 16th International Conference, ICIRA 2023, Hangzhou, China, July 5-7, 2023, Proceedings, Part IV
Author 
Yang, Huayong. editor. Liu, Honghai. editor. Zou, Jun. editor. Yin, Zhouping. editor. Liu, Lianqing. editor. (orcid)
Preferred Shelf Number 
XX(521246.1)
Electronic Access 
https://doi.org/10.1007/978-981-99-6492-5
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5. 
Cover image for Advanced Thermal Management Materials
Advanced Thermal Management Materials
Author 
Jiang, Guosheng. author. Diao, Liyong. author. Kuang, Ken. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(331292.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-1963-1
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6. 
Cover image for Piezoelectricity Evolution and Future of a Technology
Piezoelectricity Evolution and Future of a Technology
Author 
Heywang, Walter. author. Lubitz, Karl. author. Wersing, Wolfram. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-540-68683-5
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7. 
Cover image for Functional Nanostructures Processing, Characterization, and Applications
Functional Nanostructures Processing, Characterization, and Applications
Author 
Seal, Sudipta. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-48805-9
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8. 
Cover image for Ferroelectric Thin Films Basic Properties and Device Physics for Memory Applications
Ferroelectric Thin Films Basic Properties and Device Physics for Memory Applications
Author 
Okuyama, Masanori. editor. Ishibashi, Yoshihiro. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/b99517
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9. 
Cover image for Materials for Information Technology Devices, Interconnects and Packaging
Materials for Information Technology Devices, Interconnects and Packaging
Author 
Zschech, Ehrenfried. editor. Whelan, Caroline. editor. Mikolajick, Thomas. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/1-84628-235-7
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