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Cover image for Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC
Title:
Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC
Author:
Li, Er-Ping.
ISBN:
9780470623466
Publication Information:
Hoboken, N.J. : Wiley-IEEE Press, c2012.
Physical Description:
xiv, 366 p. : ill. (some col.) ; 26 cm.
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Book 7.2/14/2658 TK7874.893 L53 2012
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