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1. 
Cover image for LED packaging for lighting applications design, manufacturing, and testing
LED packaging for lighting applications design, manufacturing, and testing
Author 
Liu, S. (Sheng), 1963- Luo, Xiaobing, 1974-
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Electronic Access 
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John Wiley http://dx.doi.org/10.1002/9780470827857
http://site.ebrary.com/lib/alltitles/Doc?id=10490643
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2. 
Cover image for Reflow soldering processes SMT, BGA, CSP and flip chip technologies
Reflow soldering processes SMT, BGA, CSP and flip chip technologies
Author 
Lee, Ning-Cheng.
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Electronic Access 
Volltext http://www.sciencedirect.com/science/book/9780750672184
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3. 
Cover image for Run-to-run control in semiconductor manufacturing
Run-to-run control in semiconductor manufacturing
Author 
Moyne, James. Del Castillo, Enrique. Hurwitz, Arnon Max.
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4. 
Cover image for Thermal design of electronic equipment
Thermal design of electronic equipment
Author 
Remsburg, Ralph.
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Electronic Access 
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