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1. 
Cover image for Approaches to implementing solid waste recycling facilities
Approaches to implementing solid waste recycling facilities
Author 
Rogoff, Marc Jay. Williams, John F., 1955-
Preferred Shelf Number 
ONLINE
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9780815513520
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2. 
Cover image for Ceramic cutting tools materials, development, and performance
Ceramic cutting tools materials, development, and performance
Author 
Whitney, E. Dow.
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ONLINE
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9780815513551
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3. 
Cover image for Telecommunications network management into the 21st century techniques, standards, technologies, and applications
Telecommunications network management into the 21st century techniques, standards, technologies, and applications
Author 
Aidarous, Salah. Plevyak, Thomas. Institution of Electrical Engineers.
Preferred Shelf Number 
ONLINE
Electronic Access 
IEEE Xplore http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5263998
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4. 
Cover image for Advanced instrumentation and computer I/O design real-time system computer interface engineering
Advanced instrumentation and computer I/O design real-time system computer interface engineering
Author 
Garrett, Patrick H.
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ONLINE
Electronic Access 
IEEE Xplore http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5263677
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5. 
Cover image for Mathematical foundations for electromagnetic theory
Mathematical foundations for electromagnetic theory
Author 
Dudley, Donald G. IEEE Antennas and Propagation Society.
Preferred Shelf Number 
ONLINE
Electronic Access 
IEEE Xplore http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5263446
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6. 
Cover image for Reed-Solomon codes and their applications
Reed-Solomon codes and their applications
Author 
Wicker, Stephen B. Bhargava, Vijay K., 1948- IEEE Communications Society. IEEE Information Theory Society.
Preferred Shelf Number 
ONLINE
Electronic Access 
IEEE Xplore http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5264570
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7. 
Cover image for Writing in the technical fields a step-by-step guide for engineers, scientists, and technicians
Writing in the technical fields a step-by-step guide for engineers, scientists, and technicians
Author 
Markel, Michael H. IEEE Professional Communication Society.
Preferred Shelf Number 
ONLINE
Electronic Access 
IEEE Xplore http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5273151
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8. 
Cover image for Radiation and scattering of waves
Radiation and scattering of waves
Author 
Felsen, Leopold B. Marcuvitz, Nathan.
Preferred Shelf Number 
ONLINE
Electronic Access 
IEEE Xplore http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5264502
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9. 
Cover image for Methods in electromagnetic wave propagation
Methods in electromagnetic wave propagation
Author 
Jones, D. S. (Douglas Samuel)
Preferred Shelf Number 
ONLINE
Electronic Access 
IEEE Xplore http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5263407
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10. 
Cover image for Cold plasma in materials fabrication from fundamentals to applications
Cold plasma in materials fabrication from fundamentals to applications
Author 
Grill, Alfred.
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ONLINE
Electronic Access 
IEEE Xplore http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5271223
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11. 
Cover image for Biologische Bodensanierung Methodenbuch
Biologische Bodensanierung Methodenbuch
Author 
Alef, Kassem. Wiley InterScience (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
John Wiley http://dx.doi.org/10.1002/9783527624485
http://site.ebrary.com/lib/alltitles/Doc?id=10302249
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12. 
Cover image for Neue keramische Werkstoffe
Neue keramische Werkstoffe
Author 
Michalowsky, Lothar. Hermann, M., Dr. rer. nat.
Preferred Shelf Number 
ONLINE
Electronic Access 
Ebook Library http://public.eblib.com/EBLPublic/PublicView.do?ptiID=482180
John Wiley http://dx.doi.org/10.1002/9783527625925
http://swb.eblib.com/patron/FullRecord.aspx?p=482180
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