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1. 
Cover image for Vacuum microelectronics
Vacuum microelectronics
Author 
Zhu, Wei, 1963-
Preferred Shelf Number 
ONLINE
Electronic Access 
John Wiley http://dx.doi.org/10.1002/0471224332
Format: 
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Online Library~1
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2. 
Cover image for Microwave resonators and filters for wireless communication : theory, design, and application
Microwave resonators and filters for wireless communication : theory, design, and application
Author 
Makimoto, Mitsuo Yamashita, S., ort. yaz.
Preferred Shelf Number 
TK7872.F5 M32 2001
Format: 
Availability 
Beytepe Library~2
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3. 
Cover image for Microsystem technology
Microsystem technology
Author 
Menz, W. (Wolfgang) Mohr, J. (Jürgen) Paul, Oliver. Wiley InterScience (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
John Wiley http://dx.doi.org/10.1002/9783527613007
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4. 
Cover image for Electrochemistry of nanomaterials
Electrochemistry of nanomaterials
Author 
Hodes, Gary. Wiley InterScience (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
John Wiley http://dx.doi.org/10.1002/9783527612789
Format: 
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Online Library~1
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5. 
Cover image for Advances in Thermotropic Liquid Crystal Polymers : Thin-Film Polymerization, Characterization, Blends and Applications.
Advances in Thermotropic Liquid Crystal Polymers : Thin-Film Polymerization, Characterization, Blends and Applications.
Author 
Chung, Tai-shung, author. CRC Press.
Preferred Shelf Number 
TP1180 .P666 T48 2001
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9780367800864
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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Availability 
Online Library~1
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6. 
Cover image for Computational intelligence in manufacturing handbook
Computational intelligence in manufacturing handbook
Author 
Wang, Jun (Jun Li Jim) Kusiak, Andrew.
Preferred Shelf Number 
TS155.6 .W36 2001
Electronic Access 
Click here to view.
Format: 
Availability 
Online Library~1
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7. 
Cover image for Applied materials science : applications of engineering materials in structural, electronics, thermal, and other industries
Applied materials science : applications of engineering materials in structural, electronics, thermal, and other industries
Author 
Chung, Deborah D. L., author.
Preferred Shelf Number 
TA403 .C47 2001
Electronic Access 
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