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1. 
Cover image for Power Electronic Packaging Design, Assembly Process, Reliability and Modeling
Power Electronic Packaging Design, Assembly Process, Reliability and Modeling
Author 
Liu, Yong. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-1053-9
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2. 
Cover image for Bio and Nano Packaging Techniques for Electron Devices Advances in Electronic Device Packaging
Bio and Nano Packaging Techniques for Electron Devices Advances in Electronic Device Packaging
Author 
Gerlach, Gerald. editor. Wolter, Klaus-Jürgen. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-28522-6
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3. 
Cover image for Hermeticity of electronic packages
Hermeticity of electronic packages
Author 
Greenhouse, Hal. Lowry, Robert (Robert K.), 1944- Romenesko, Bruce.
Preferred Shelf Number 
ONLINE
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9781437778779
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Online Library~1
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