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Cover image for Mechanical, electronic and engineering technologies (ICMEET 2014) : selected, peer reviewed papers from the 2014 International Conference on Mechanical, Electronic and Engineering Technology (ICMEET 2014), May 9-11, 2014, Taipei, Taiwan
Mechanical, electronic and engineering technologies (ICMEET 2014) : selected, peer reviewed papers from the 2014 International Conference on Mechanical, Electronic and Engineering Technology (ICMEET 2014), May 9-11, 2014, Taipei, Taiwan
Author 
Huang, Jeng-Tze, editor. Feng, Wu-Shiung, organizer.
Preferred Shelf Number 
TJ5 M434 2014
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Beytepe Library~1
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2. 
Cover image for Interatomic bonding in solids fundamentals, simulation, applications
Interatomic bonding in solids fundamentals, simulation, applications
Author 
Levitin, Valim.
Preferred Shelf Number 
ONLINE(342212.1)
Electronic Access 
John Wiley http://dx.doi.org/10.1002/9783527671557
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Online Library~1
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