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1. 
Cover image for Laser-induced damage in optical materials
Laser-induced damage in optical materials
Author 
Ristau, Detlev, editor.
Preferred Shelf Number 
ONLINE(356539.1)
Electronic Access 
Distributed by publisher. Purchase or institutional license may be required for access.
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Online Library~1
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2. 
Cover image for Laser surface engineering : processes and applications
Laser surface engineering : processes and applications
Author 
Lawrence, J., editor. Waugh, D. G., editor. Aoyagi, N., contributor.
Preferred Shelf Number 
ONLINE(355461.1)
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9781782420743
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3. 
Cover image for Dynamical properties of solids
Dynamical properties of solids
Author 
Horton, George K., ed. Maradudin, A. A., ed.
Preferred Shelf Number 
QC 176.8.L3 D993 1974- V.1
Format: 
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Beytepe Library~4
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4. 
Cover image for Integrated Imaging and Vision Techniques for Industrial Inspection Advances and Applications
Integrated Imaging and Vision Techniques for Industrial Inspection Advances and Applications
Author 
Liu, Zheng. editor. Ukida, Hiroyuki. editor. Ramuhalli, Pradeep. editor. Niel, Kurt. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4471-6741-9
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5. 
Cover image for Silicon Analog Components Device Design, Process Integration, Characterization, and Reliability
Silicon Analog Components Device Design, Process Integration, Characterization, and Reliability
Author 
El-Kareh, Badih. author. Hutter, Lou N. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4939-2751-7
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6. 
Cover image for Numerical Simulation of Mechatronic Sensors and Actuators Finite Elements for Computational Multiphysics
Numerical Simulation of Mechatronic Sensors and Actuators Finite Elements for Computational Multiphysics
Author 
Kaltenbacher, Manfred. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-642-40170-1
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7. 
Cover image for Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability
Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability
Author 
Lee, Tae-Kyu. author. Bieler, Thomas R. author. Kim, Choong-Un. author. Ma, Hongtao. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4614-9266-5
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8. 
Cover image for Carbon Nanotube Based VLSI Interconnects Analysis and Design
Carbon Nanotube Based VLSI Interconnects Analysis and Design
Author 
Kaushik, Brajesh Kumar. author. Majumder, Manoj Kumar. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-81-322-2047-3
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9. 
Cover image for Experimental and Applied Mechanics, Volume 6 Proceedings of the 2014 Annual Conference on Experimental and Applied Mechanics
Experimental and Applied Mechanics, Volume 6 Proceedings of the 2014 Annual Conference on Experimental and Applied Mechanics
Author 
Sottos, Nancy. editor. Rowlands, Robert. editor. Dannemann, Kathryn. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-06989-0
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10. 
Cover image for Molecular Modeling and Multiscaling Issues for Electronic Material Applications Volume 2
Molecular Modeling and Multiscaling Issues for Electronic Material Applications Volume 2
Author 
Wymyslowski, Artur. editor. Iwamoto, Nancy. editor. Yuen, Matthew. editor. Fan, Haibo. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-12862-7
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11. 
Cover image for Reliable Design of Electronic Equipment An Engineering Guide
Reliable Design of Electronic Equipment An Engineering Guide
Author 
Natarajan, Dhanasekharan. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-09111-2
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12. 
Cover image for Hyper Bio Assembler for 3D Cellular Systems
Hyper Bio Assembler for 3D Cellular Systems
Author 
Arai, Tatsuo. editor. Arai, Fumihito. editor. Yamato, Masayuki. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-4-431-55297-0
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