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1. 
Cover image for Advances and Trends in Artificial Intelligence. Theory and Applications 36th International Conference on Industrial, Engineering and Other Applications of Applied Intelligent Systems, IEA/AIE 2023, Shanghai, China, July 19-22, 2023, Proceedings, Part II
Advances and Trends in Artificial Intelligence. Theory and Applications 36th International Conference on Industrial, Engineering and Other Applications of Applied Intelligent Systems, IEA/AIE 2023, Shanghai, China, July 19-22, 2023, Proceedings, Part II
Author 
Fujita, Hamido. editor. (orcid) Wang, Yinglin. editor. Xiao, Yanghua. editor. Moonis, Ali. editor. SpringerLink (Online service)
Preferred Shelf Number 
XX(521094.1)
Electronic Access 
https://doi.org/10.1007/978-3-031-36822-6
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2. 
Cover image for Information and Communication Technologies in Education, Research, and Industrial Applications 18th International Conference, ICTERI 2023, Ivano-Frankivsk, Ukraine, September 18-22, 2023, Proceedings
Information and Communication Technologies in Education, Research, and Industrial Applications 18th International Conference, ICTERI 2023, Ivano-Frankivsk, Ukraine, September 18-22, 2023, Proceedings
Author 
Antoniou, Grigoris. editor. Ermolayev, Vadim. editor. Kobets, Vitaliy. editor. Liubchenko, Vira. editor. Mayr, Heinrich C. editor.
Preferred Shelf Number 
XX(520741.1)
Electronic Access 
https://doi.org/10.1007/978-3-031-48325-7
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3. 
Cover image for Advances and Trends in Artificial Intelligence. Theory and Applications 36th International Conference on Industrial, Engineering and Other Applications of Applied Intelligent Systems, IEA/AIE 2023, Shanghai, China, July 19-22, 2023, Proceedings, Part I
Advances and Trends in Artificial Intelligence. Theory and Applications 36th International Conference on Industrial, Engineering and Other Applications of Applied Intelligent Systems, IEA/AIE 2023, Shanghai, China, July 19-22, 2023, Proceedings, Part I
Author 
Fujita, Hamido. editor. (orcid) Wang, Yinglin. editor. Xiao, Yanghua. editor. Moonis, Ali. editor. SpringerLink (Online service)
Preferred Shelf Number 
XX(521400.1)
Electronic Access 
https://doi.org/10.1007/978-3-031-36819-6
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4. 
Cover image for Handbook of adhesives and sealants. Volume 1, Adhesives and sealants basic concepts and high tech bonding
Handbook of adhesives and sealants. Volume 1, Adhesives and sealants basic concepts and high tech bonding
Author 
Cognard, Philippe.
Preferred Shelf Number 
ONLINE
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9780080445540
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5. 
Cover image for Handbook of adhesives and sealants
Handbook of adhesives and sealants
Author 
Cognard, Philippe.
Preferred Shelf Number 
ONLINE
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9780080447087
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6. 
Cover image for Polyimides and other high temperature polymers synthesis, characterization and applications.
Polyimides and other high temperature polymers synthesis, characterization and applications.
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International Symposium on Polyimides and other High Temperature Polymers.
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ONLINE
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Distributed by publisher. Purchase or institutional license may be required for access.
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7. 
Cover image for Polyimides and other high temperature polymers synthesis, characterization and applications.
Polyimides and other high temperature polymers synthesis, characterization and applications.
Author 
International Symposium on Polyimides and other High Temperature Polymers.
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ONLINE
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Distributed by publisher. Purchase or institutional license may be required for access.
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8. 
Cover image for Machine Learning and Mechanics Based Soft Computing Applications
Machine Learning and Mechanics Based Soft Computing Applications
Author 
Nguyen, Thi Dieu Linh. editor. Lu, Joan. editor. SpringerLink (Online service)
Preferred Shelf Number 
XX(520290.1)
Electronic Access 
https://doi.org/10.1007/978-981-19-6450-3
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9. 
Cover image for Subject-Oriented Business Process Management. Models for Designing Digital Transformations 14th International Conference, S-BPM ONE 2023, Rostock, Germany, May 31 - June 1, 2023, Proceedings
Subject-Oriented Business Process Management. Models for Designing Digital Transformations 14th International Conference, S-BPM ONE 2023, Rostock, Germany, May 31 - June 1, 2023, Proceedings
Author 
Elstermann, Matthes. editor. Dittmar, Anke. editor. Lederer, Matthias. editor. SpringerLink (Online service)
Preferred Shelf Number 
XX(520440.1)
Electronic Access 
https://doi.org/10.1007/978-3-031-40213-5
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10. 
Cover image for Pattern Recognition, Computer Vision, and Image Processing. ICPR 2022 International Workshops and Challenges Montreal, QC, Canada, August 21-25, 2022, Proceedings, Part III
Pattern Recognition, Computer Vision, and Image Processing. ICPR 2022 International Workshops and Challenges Montreal, QC, Canada, August 21-25, 2022, Proceedings, Part III
Author 
Rousseau, Jean-Jacques. editor. (orcid) Kapralos, Bill. editor. SpringerLink (Online service)
Preferred Shelf Number 
XX(521063.1)
Electronic Access 
https://doi.org/10.1007/978-3-031-37731-0
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11. 
Cover image for Towards Autonomous Robotic Systems 24th Annual Conference, TAROS 2023, Cambridge, UK, September 13-15, 2023, Proceedings
Towards Autonomous Robotic Systems 24th Annual Conference, TAROS 2023, Cambridge, UK, September 13-15, 2023, Proceedings
Author 
Iida, Fumiya. editor. Maiolino, Perla. editor. Abdulali, Arsen. editor. Wang, Mingfeng. editor. SpringerLink (Online service)
Preferred Shelf Number 
XX(521131.1)
Electronic Access 
https://doi.org/10.1007/978-3-031-43360-3
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12. 
Cover image for Computer Information Systems and Industrial Management 22nd International Conference, CISIM 2023, Tokyo, Japan, September 22-24, 2023, Proceedings
Computer Information Systems and Industrial Management 22nd International Conference, CISIM 2023, Tokyo, Japan, September 22-24, 2023, Proceedings
Author 
Saeed, Khalid. editor. (orcid) Dvorský, Jiří. editor. Nishiuchi, Nobuyuki. editor. Fukumoto, Makoto. editor. SpringerLink (Online service)
Preferred Shelf Number 
XX(521140.1)
Electronic Access 
https://doi.org/10.1007/978-3-031-42823-4
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