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International Symposium on Polyimides and other High Temperature Polymers.
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1. 
Cover image for High temperature oxides
High temperature oxides
Author 
M. Alper, Allen, ed.
Preferred Shelf Number 
TN 677 H54 1970-1971 V.1
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Beytepe Library~4
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2. 
Cover image for Progress in low temperature physics
Progress in low temperature physics
Author 
Gorter, Cornelis Jacobus, 1907- ed.
Preferred Shelf Number 
QC 278 G6 1955- V.4
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3. 
Cover image for Progress in low temperature physics
Progress in low temperature physics
Author 
Gorter, Cornelis Jacobus, 1907-
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ONLINE
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9780444872739
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4. 
Cover image for Polyimides and other high temperature polymers synthesis, characterization and applications.
Polyimides and other high temperature polymers synthesis, characterization and applications.
Author 
International Symposium on Polyimides and other High Temperature Polymers.
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ONLINE
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Distributed by publisher. Purchase or institutional license may be required for access.
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5. 
Cover image for Polyimides and other high temperature polymers synthesis, characterization and applications.
Polyimides and other high temperature polymers synthesis, characterization and applications.
Author 
International Symposium on Polyimides and other High Temperature Polymers.
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ONLINE
Electronic Access 
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6. 
Cover image for The Power of Data: Driving Climate Change with Data Science and Artificial Intelligence Innovations
The Power of Data: Driving Climate Change with Data Science and Artificial Intelligence Innovations
Author 
Hassanien, Aboul Ella. editor. Darwish, Ashraf. editor. SpringerLink (Online service)
Preferred Shelf Number 
XX(520303.1)
Electronic Access 
https://doi.org/10.1007/978-3-031-22456-0
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7. 
Cover image for Low Power Architectures for IoT Applications
Low Power Architectures for IoT Applications
Author 
Sharma, Devendra Kumar. editor. Sharma, Rohit. editor. Jeon, Gwanggil. editor. Polkowski, Zdzislaw. editor. SpringerLink (Online service)
Preferred Shelf Number 
XX(520314.1)
Electronic Access 
https://doi.org/10.1007/978-981-99-0639-0
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8. 
Cover image for 6GN for Future Wireless Networks 5th EAI International Conference, 6GN 2022, Harbin, China, December 17-18, 2022, Proceedings, Part II
6GN for Future Wireless Networks 5th EAI International Conference, 6GN 2022, Harbin, China, December 17-18, 2022, Proceedings, Part II
Author 
Li, Ao. editor. Shi, Yao. editor. Xi, Liang. editor. SpringerLink (Online service)
Preferred Shelf Number 
XX(520491.1)
Electronic Access 
https://doi.org/10.1007/978-3-031-36014-5
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9. 
Cover image for Advances in Computing and Data Sciences 7th International Conference, ICACDS 2023, Kolkata, India, April 27-28, 2023, Revised Selected Papers
Advances in Computing and Data Sciences 7th International Conference, ICACDS 2023, Kolkata, India, April 27-28, 2023, Revised Selected Papers
Author 
Singh, Mayank. editor. Tyagi, Vipin. editor. Gupta, P.K. editor. Flusser, Jan. editor. Ören, Tuncer. editor.
Preferred Shelf Number 
XX(520521.1)
Electronic Access 
https://doi.org/10.1007/978-3-031-37940-6
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10. 
Cover image for Database and Expert Systems Applications 34th International Conference, DEXA 2023, Penang, Malaysia, August 28-30, 2023, Proceedings, Part II
Database and Expert Systems Applications 34th International Conference, DEXA 2023, Penang, Malaysia, August 28-30, 2023, Proceedings, Part II
Author 
Strauss, Christine. editor. Amagasa, Toshiyuki. editor. Kotsis, Gabriele. editor. Tjoa, A Min. editor. Khalil, Ismail. editor.
Preferred Shelf Number 
XX(521071.1)
Electronic Access 
https://doi.org/10.1007/978-3-031-39821-6
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11. 
Cover image for Speeding-Up Radio-Frequency Integrated Circuit Sizing with Neural Networks
Speeding-Up Radio-Frequency Integrated Circuit Sizing with Neural Networks
Author 
Domingues, João L. C. P. author. Vaz, Pedro J. C. D. C. author. Gusmão, António P. L. author. Horta, Nuno C. G. author. Lourenço, Nuno C. C. author.
Preferred Shelf Number 
XX(520367.1)
Electronic Access 
https://doi.org/10.1007/978-3-031-25099-6
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12. 
Cover image for Advanced Hybrid Information Processing 6th EAI International Conference, ADHIP 2022, Changsha, China, September 29-30, 2022, Proceedings, Part I
Advanced Hybrid Information Processing 6th EAI International Conference, ADHIP 2022, Changsha, China, September 29-30, 2022, Proceedings, Part I
Author 
Fu, Weina. editor. Yun, Lin. editor. SpringerLink (Online service)
Preferred Shelf Number 
XX(520370.1)
Electronic Access 
https://doi.org/10.1007/978-3-031-28787-9
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