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13. 
Cover image for Modeling and Application of Flexible Electronics Packaging
Modeling and Application of Flexible Electronics Packaging
Modeling and Application of Flexible Electronics Packaging
Author 
Huang, YongAn. author. Yin, Zhouping. author. Wan, Xiaodong. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-13-3627-0
Format: 
Availability 
Online Library~1
Available: 1
Copies: 1
14. 
Cover image for CAD, 3D Modeling, Engineering Analysis, and Prototype Experimentation Industrial and Research Applications
CAD, 3D Modeling, Engineering Analysis, and Prototype Experimentation Industrial and Research Applications
CAD, 3D Modeling, Engineering Analysis, and Prototype Experimentation Industrial and Research Applications
Author 
Zheng Li, Jeremy. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-05921-1
Format: 
Availability 
Online Library~1
Available: 1
Copies: 1
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