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2015
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2023
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1. 
Cover image for Modular Multilevel Converter Modelling and Simulation for HVDC Systems State of the Art and a Novel Approach
Modular Multilevel Converter Modelling and Simulation for HVDC Systems State of the Art and a Novel Approach
Author 
del Giudice, Davide. author. Bizzarri, Federico. author. Linaro, Daniele. author. Brambilla, Angelo Maurizio. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-12818-9
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2. 
Cover image for Selected Sensor Circuits From Data Sheet to Simulation
Selected Sensor Circuits From Data Sheet to Simulation
Author 
Baumann, Peter. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-658-38212-4
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3. 
Cover image for Microwave and Millimeter-Wave Chips Based on Thin-Film Integrated Passive Device Technology Design and Simulation
Microwave and Millimeter-Wave Chips Based on Thin-Film Integrated Passive Device Technology Design and Simulation
Author 
Wu, Yongle. author. Wang, Weimin. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-1455-5
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4. 
Cover image for Out-of-order Parallel Discrete Event Simulation for Electronic System-level Design
Out-of-order Parallel Discrete Event Simulation for Electronic System-level Design
Author 
Chen, Weiwei. author. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-3-319-08753-5
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5. 
Cover image for Advanced X-Ray Radiation Detection: Medical Imaging and Industrial Applications
Advanced X-Ray Radiation Detection: Medical Imaging and Industrial Applications
Author 
Iniewski, Krzysztof (Kris). editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-030-92989-3
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6. 
Cover image for Essential Circuit Analysis using LTspice®
Essential Circuit Analysis using LTspice®
Author 
Asadi, Farzin. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-09853-6
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7. 
Cover image for Essential Circuit Analysis Using Proteus®
Essential Circuit Analysis Using Proteus®
Author 
Asadi, Farzin. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-19-4353-9
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8. 
Cover image for Interconnect Reliability in Advanced Memory Device Packaging
Interconnect Reliability in Advanced Memory Device Packaging
Author 
Gan, Chong Leong,. author. Huang, Chen-Yu,. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-26708-6
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9. 
Cover image for Introduction to Mechatronics An Integrated Approach
Introduction to Mechatronics An Integrated Approach
Author 
Samanta, Biswanath. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-29320-7
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10. 
Cover image for Data Transmission at Millimeter Waves Exploiting the 60 GHz Band on Silicon
Data Transmission at Millimeter Waves Exploiting the 60 GHz Band on Silicon
Author 
Khalaf, Khaled. author. Vidojkovic, Vojkan. author. Wambacq, Piet. author. Long, John R. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-662-46938-5
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11. 
Cover image for Spintronics-based Computing
Spintronics-based Computing
Author 
Zhao, Weisheng. editor. Prenat, Guillaume. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-15180-9
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12. 
Cover image for Thermal Sensors Principles and Applications for Semiconductor Industries
Thermal Sensors Principles and Applications for Semiconductor Industries
Author 
Jha, Chandra Mohan. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4939-2581-0
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