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Cover image for Reflow soldering processes SMT, BGA, CSP and flip chip technologies
Reflow soldering processes SMT, BGA, CSP and flip chip technologies
Author 
Lee, Ning-Cheng.
Preferred Shelf Number 
ONLINE
Electronic Access 
Volltext http://www.sciencedirect.com/science/book/9780750672184
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Online Library~1
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2. 
Cover image for Thermal design of electronic equipment
Thermal design of electronic equipment
Author 
Remsburg, Ralph., author.
Preferred Shelf Number 
TK7870.25 .R46 2001
Electronic Access 
Click here to view.
Format: 
Availability 
Online Library~1
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3. 
Cover image for Electronic techniques : shop practices and construction
Electronic techniques : shop practices and construction
Author 
Villanucci, Robert S., 1944- Avtgis, Alexander W. Megow, William F.
Preferred Shelf Number 
TK7836 .V55 1996
Format: 
Availability 
Beytepe Library~1
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