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Subject: Electronic packaging.

Author

Greenhouse, Hal.

(2)

Avtgis, Alexander W.

(1)

Del Castillo, Enrique.

(1)

(1)

Hurwitz, Arnon Max.

(1)

Jamnia, Ali, 1961-

(1)

Lee, Ning-Cheng.

(1)

Licari, James J., 1930-

(1)

Liu, S. (Sheng), 1963-

(1)

Lowry, Robert (Robert K.), 1944-

(1)

Luo, Xiaobing, 1974-

(1)

Megow, William F.

(1)

(1)

Pengelly, Raymond S.

(1)

Puttlitz, Karl J.

(1)

Remsburg, Ralph.

(1)

Romenesko, Bruce.

(1)

Stalter, Kathleen A.

(1)

Suganuma, Katsuaki.

(1)

Swanson, Dale W.

(1)

Süli, Frank, author.

(1)

Tai-Ran Hsu, ed.

(1)

Villanucci, Robert S., 1944-

(1)

Language

(15)

Publication Date

-

(3)

(2)

(2)

(1)

(1)

(1)

(1)

(1)

(1)

(1)

(1)

Subject

Electronic apparatus and appliances -- Design and construction.

(3)

Solder and soldering.

(3)

Chip scale packaging.

(2)

Electronics -- Materials -- Permeability.

(2)

Sealing (Technology)

(2)

(1)

Aerospace engineering.

(1)

Amplifiers (Electronics).

(1)

(1)

(1)

Dichtung (Technik)

(1)

Electric connectors.

(1)

Electric lighting -- Equipment and supplies.

(1)

Electronic apparatus and appliances -- Thermal properties.

(1)

Electronic books.

(1)

Electronics -- Materials.

(1)

Elektronik aygıtlar ve aletler -- Tasarım ve yapım.

(1)

Elektronik paketleme.

(1)

Elektronisches Bauelement.

(1)

Environmental protection.

(1)

Field-effect transistors.

(1)

Gallium arsenide.

(1)

Green products.

(1)

Heat -- Transmission.

(1)

Light emitting diodes -- Computer simulation.

(1)

Light emitting diodes -- Design and construction.

(1)

Microelectromechanical systems.

(1)

Microelectronic packaging.

(1)

Microelectronics.

(1)

Microfabrication.

(1)

Micromechanics.

(1)

Microwave transistors.

(1)

Mixing circuits.

(1)

Nanostructured materials.

(1)

Optoelectronic devices.

(1)

Oscillators, Electric.

(1)

Passive components.

(1)

Production management.

(1)

Sealing (Technology).

(1)

Semiconductor industry -- Production control.

(1)

Semiconductors -- Design and construction.

(1)

Semiconductors.

(1)

Telecommunication.

(1)

Material Type

Shelf Location

Beytepe General Collection

Electronic Library

Library

Beytepe Library

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1.

Cover image for Electronic enclosures, housings and packages

Electronic enclosures, housings and packages

Electronic enclosures, housings and packages

Author

Süli, Frank, author.

Preferred Shelf Number

ONLINE

Electronic Access

ScienceDirect https://www.sciencedirect.com/science/book/9780081023914

Format:

Availability

Online Library~1

Available:
Copies:

2.

Cover image for Hermeticity of electronic packages

Hermeticity of electronic packages

Hermeticity of electronic packages

Author

Greenhouse, Hal. Lowry, Robert (Robert K.), 1944- Romenesko, Bruce.

Preferred Shelf Number

ONLINE

Electronic Access

ScienceDirect http://www.sciencedirect.com/science/book/9781437778779

Format:

Availability

Online Library~1

Available:
Copies:

3.

Cover image for MEMS/MOEMS packaging concepts, designs, materials, and processes

MEMS/MOEMS packaging concepts, designs, materials, and processes

MEMS/MOEMS packaging concepts, designs, materials, and processes

Author

Gilleo, Ken.

Preferred Shelf Number

ONLINE

Electronic Access

Subscription required

Format:

Availability

Online Library~1

Available:
Copies:

4.

Cover image for LED packaging for lighting applications design, manufacturing, and testing

LED packaging for lighting applications design, manufacturing, and testing

LED packaging for lighting applications design, manufacturing, and testing

Author

Liu, S. (Sheng), 1963- Luo, Xiaobing, 1974-

Preferred Shelf Number

ONLINE

Electronic Access

Click here to view book
John Wiley http://dx.doi.org/10.1002/9780470827857
http://site.ebrary.com/lib/alltitles/Doc?id=10490643

Format:

Availability

Online Library~1

Available:
Copies:

5.

Cover image for Practical guide to the packaging of electronics thermal and mechanical design and analysis

Practical guide to the packaging of electronics thermal and mechanical design and analysis

Practical guide to the packaging of electronics thermal and mechanical design and analysis

Author

Jamnia, Ali, 1961-

Preferred Shelf Number

ONLINE

Electronic Access

Distributed by publisher. Purchase or institutional license may be required for access.

Format:

Availability

Online Library~1

Available:
Copies:

6.

Cover image for Adhesives technology for electronic applications materials, processes, reliability

Adhesives technology for electronic applications materials, processes, reliability

Adhesives technology for electronic applications materials, processes, reliability

Author

Licari, James J., 1930- Swanson, Dale W.

Preferred Shelf Number

ONLINE

Electronic Access

ScienceDirect http://www.sciencedirect.com/science/book/9780815515135

Format:

Availability

Online Library~1

Available:
Copies:

7.

Cover image for Lead-free soldering in electronics science, technology and environmental impact

Lead-free soldering in electronics science, technology and environmental impact

Lead-free soldering in electronics science, technology and environmental impact

Author

Suganuma, Katsuaki.

Preferred Shelf Number

ONLINE

Electronic Access

Distributed by publisher. Purchase or institutional license may be required for access.

Format:

Availability

Online Library~1

Available:
Copies:

8.

Cover image for MEMS Packaging

Author

Tai-Ran Hsu, ed.

Preferred Shelf Number

ONLINE

Electronic Access

http://dx.doi.org/10.1049/PBEP003E

Format:

Availability

Online Library~1

Available:
Copies:

9.

Cover image for Handbook of lead-free solder technology for microelectronic assemblies

Handbook of lead-free solder technology for microelectronic assemblies

Handbook of lead-free solder technology for microelectronic assemblies

Author

Puttlitz, Karl J. Stalter, Kathleen A.

Preferred Shelf Number

ONLINE

Electronic Access

Distributed by publisher. Purchase or institutional license may be required for access.

Format:

Availability

Online Library~1

Available:
Copies:

10.

Cover image for Reflow soldering processes SMT, BGA, CSP and flip chip technologies

Reflow soldering processes SMT, BGA, CSP and flip chip technologies

Reflow soldering processes SMT, BGA, CSP and flip chip technologies

Author

Lee, Ning-Cheng.

Preferred Shelf Number

ONLINE

Electronic Access

Volltext http://www.sciencedirect.com/science/book/9780750672184

Format:

Availability

Online Library~1

Available:
Copies:

11.

Cover image for Thermal design of electronic equipment

Thermal design of electronic equipment

Thermal design of electronic equipment

Author

Remsburg, Ralph.

Preferred Shelf Number

ONLINE

Electronic Access

Distributed by publisher. Purchase or institutional license may be required for access.

Format:

Availability

Online Library~1

Available:
Copies:

12.

Cover image for Run-to-run control in semiconductor manufacturing

Run-to-run control in semiconductor manufacturing

Run-to-run control in semiconductor manufacturing

Author

Moyne, James. Del Castillo, Enrique. Hurwitz, Arnon Max.

Preferred Shelf Number

ONLINE

Electronic Access

Distributed by publisher. Purchase or institutional license may be required for access.

Format:

Availability

Online Library~1

Available:
Copies:

1 2

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