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1. 
Cover image for Microelectronics, Communication Systems, Machine Learning and Internet of Things Select Proceedings of MCMI 2020
Microelectronics, Communication Systems, Machine Learning and Internet of Things Select Proceedings of MCMI 2020
Author 
Nath, Vijay. editor. Mandal, Jyotsna Kumar. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-19-1906-0
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2. 
Cover image for Cellular V2X for connected automated driving
Cellular V2X for connected automated driving
Author 
Fallgren, Mikael, editor. Dillinger, Markus, editor. Mahmoodi, Toktam, editor. Svensson, Tommy (Highway engineer), editor.
Preferred Shelf Number 
TE228.37 .C45 2021
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119692676
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3. 
Cover image for Molecular Modeling and Multiscaling Issues for Electronic Material Applications Volume 2
Molecular Modeling and Multiscaling Issues for Electronic Material Applications Volume 2
Author 
Wymyslowski, Artur. editor. Iwamoto, Nancy. editor. Yuen, Matthew. editor. Fan, Haibo. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-12862-7
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4. 
Cover image for Advancement of Optical Methods in Experimental Mechanics, Volume 3 Proceedings of the 2014 Annual Conference on Experimental and Applied Mechanics
Advancement of Optical Methods in Experimental Mechanics, Volume 3 Proceedings of the 2014 Annual Conference on Experimental and Applied Mechanics
Author 
Jin, Helena. editor. Sciammarella, Cesar. editor. Yoshida, Sanichiro. editor. Lamberti, Luciano. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-06986-9
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