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1. 
Cover image for Electromagnetic Compatibility for Device Design and System Integration
Electromagnetic Compatibility for Device Design and System Integration
Author 
Gonschorek, Karl-Heinz. author. Vick, Ralf. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-03290-5
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2. 
Cover image for Smart sensors for industry 4.0 : fundamentals, fabrication and IIoT applications
Smart sensors for industry 4.0 : fundamentals, fabrication and IIoT applications
Author 
Mishra, Brojo Kishore, 1979- editor. Mallik, Sandipan, editor. Le, Dac-Nhuong, 1983- editor.
Preferred Shelf Number 
TK7872 .D48 S63 2024
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394214723
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3. 
Cover image for Microelectronics, Communication Systems, Machine Learning and Internet of Things Select Proceedings of MCMI 2020
Microelectronics, Communication Systems, Machine Learning and Internet of Things Select Proceedings of MCMI 2020
Author 
Nath, Vijay. editor. Mandal, Jyotsna Kumar. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-19-1906-0
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4. 
Cover image for Chiplet Design and Heterogeneous Integration Packaging
Chiplet Design and Heterogeneous Integration Packaging
Author 
Lau, John H. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-19-9917-8
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5. 
Cover image for Graphene for post-Moore silicon optoelectronics
Graphene for post-Moore silicon optoelectronics
Author 
Xu, Yang, author.
Preferred Shelf Number 
TA1750 .X8 2023
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527841011
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6. 
Cover image for Electromechanical coupling theory, methodology and applications for high-performance microwave equipment
Electromechanical coupling theory, methodology and applications for high-performance microwave equipment
Author 
Duan, Baoyan, author. Zhang, Shuxin (Professor of electromechanical engineering), author.
Preferred Shelf Number 
TK7876 .D83 2023
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119904427
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7. 
Cover image for Sensing technologies for real time monitoring of water quality
Sensing technologies for real time monitoring of water quality
Author 
Manjakkal, Libu, author. Lorenzelli, Leandro, author. Willander, M., author.
Preferred Shelf Number 
TD367 .M3175 2023
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119775843
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8. 
Cover image for Evolving networking technologies : developments and future directions
Evolving networking technologies : developments and future directions
Author 
Gupta, Shaurya, editor.
Preferred Shelf Number 
TK5105.5 .E96 2023
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119836667
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9. 
Cover image for System architecture and complexity : contribution of systems of systems to systems thinking
System architecture and complexity : contribution of systems of systems to systems thinking
Author 
Printz, Jacques.
Preferred Shelf Number 
Q295
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119751519
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10. 
Cover image for Systems engineering in the fourth industrial revolution : big data, novel technologies, and modern systems engineering
Systems engineering in the fourth industrial revolution : big data, novel technologies, and modern systems engineering
Author 
Kenett, Ron, editor. Swarz, Robert S., editor. Zonnenshain, Avigdor, editor.
Preferred Shelf Number 
TA168 .S8727 2020
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119513957
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11. 
Cover image for Advances in embedded and fan-out wafer level packaging technologies
Advances in embedded and fan-out wafer level packaging technologies
Author 
Keser, Beth, 1971- editor. Kroehnert, Steffen, 1970- editor.
Preferred Shelf Number 
TK7870.17 .A38 2019
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119313991
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12. 
Cover image for Handbook of 3D integration. Volume 4, Design, test, and thermal management
Handbook of 3D integration. Volume 4, Design, test, and thermal management
Author 
Franzon, Paul D., editor. Marinissen, Eric Jan, editor. Bakir, Muhannad S., editor.
Preferred Shelf Number 
TK7874.893 .H36 2019
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527697052
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