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2007
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Cover image for Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
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Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/0-387-32989-7
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Cover image for Anwendungstechnologie Aluminum
Anwendungstechnologie Aluminum
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Ostermann, Friedrich. author. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/978-3-540-69451-9
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