Search Results for packaging.

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Packaging for Sustainability

Author

Verghese, Karli. editor. Lewis, Helen. editor. Fitzpatrick, Leanne. editor. SpringerLink (Online service)

Preferred Shelf Number

ONLINE

Electronic Access

http://dx.doi.org/10.1007/978-0-85729-988-8

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Integrated Circuit Packaging, Assembly and Interconnections

Author

Greig, William J. author. SpringerLink (Online service)

Preferred Shelf Number

ONLINE

Electronic Access

http://dx.doi.org/10.1007/0-387-33913-2

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Online Library~1

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Systems-Level Packaging for Millimeter-Wave Transceivers

Author

Božanić, Mladen. author. (orcid)0000-0001-9174-0781 Sinha, Saurabh. author. SpringerLink (Online service)

Preferred Shelf Number

ONLINE

Electronic Access

https://doi.org/10.1007/978-3-030-14690-0

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Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging

Author

Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)

Preferred Shelf Number

ONLINE

Electronic Access

http://dx.doi.org/10.1007/0-387-32989-7

Format:

Availability

Online Library~1

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CAD, 3D Modeling, Engineering Analysis, and Prototype Experimentation Industrial and Research Applications

Author

Zheng Li, Jeremy. author. SpringerLink (Online service)

Preferred Shelf Number

ONLINE

Electronic Access

https://doi.org/10.1007/978-3-319-05921-1

Format:

Availability

Online Library~1

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