Materials for Information Technology Devices, Interconnects and Packaging

Title:

Author:

Zschech, Ehrenfried. editor.

ISBN:

9781846282355

Physical Description:

XIX, 508 p. 338 illus. online resource.

Series:

Engineering Materials and Processes,

Series Title:

Engineering Materials and Processes, 1619-0181

Subject Term:

Added Author:

Added Corporate Author:

Electronic Access:

Holds:
Copies:

Library	Material Type	Item Barcode	Shelf Number	Status	Item Holds
Searching... Online Library	E-Book	175333-2001	ONLINE	Searching... Unknown	Searching... Unavailable