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1. 
Cover image for Lead-Free Electronic Solders A Special Issue of the Journal of Materials Science: Materials in Electronics
Lead-Free Electronic Solders A Special Issue of the Journal of Materials Science: Materials in Electronics
Author 
Subramanian, K. N. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-48433-4
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2. 
Cover image for Advanced Thermal Management Materials
Advanced Thermal Management Materials
Author 
Jiang, Guosheng. author. Diao, Liyong. author. Kuang, Ken. author. SpringerLink (Online service)
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ONLINE(331292.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-1963-1
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3. 
Cover image for Piezoelectricity Evolution and Future of a Technology
Piezoelectricity Evolution and Future of a Technology
Author 
Heywang, Walter. author. Lubitz, Karl. author. Wersing, Wolfram. author. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/978-3-540-68683-5
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4. 
Cover image for Functional Nanostructures Processing, Characterization, and Applications
Functional Nanostructures Processing, Characterization, and Applications
Author 
Seal, Sudipta. editor. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/978-0-387-48805-9
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5. 
Cover image for Ferroelectric Thin Films Basic Properties and Device Physics for Memory Applications
Ferroelectric Thin Films Basic Properties and Device Physics for Memory Applications
Author 
Okuyama, Masanori. editor. Ishibashi, Yoshihiro. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/b99517
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6. 
Cover image for Materials for Information Technology Devices, Interconnects and Packaging
Materials for Information Technology Devices, Interconnects and Packaging
Author 
Zschech, Ehrenfried. editor. Whelan, Caroline. editor. Mikolajick, Thomas. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/1-84628-235-7
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