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1. 
Cover image for Ferroelectrics in Microwave Devices, Circuits and Systems Physics, Modeling, Fabrication and Measurements
Ferroelectrics in Microwave Devices, Circuits and Systems Physics, Modeling, Fabrication and Measurements
Author 
Gevorgian, Spartak. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-84882-507-9
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2. 
Cover image for Gallium Nitride-enabled High Frequency and High Efficiency Power Conversion
Gallium Nitride-enabled High Frequency and High Efficiency Power Conversion
Author 
Meneghesso, Gaudenzio. editor. Meneghini, Matteo. editor. Zanoni, Enrico. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-77994-2
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3. 
Cover image for Applications of Organic and Printed Electronics A Technology-Enabled Revolution
Applications of Organic and Printed Electronics A Technology-Enabled Revolution
Author 
Cantatore, Eugenio. editor. SpringerLink (Online service)
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ONLINE(331320.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-3160-2
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4. 
Cover image for Three Dimensional Integrated Circuit Design EDA, Design and Microarchitectures
Three Dimensional Integrated Circuit Design EDA, Design and Microarchitectures
Author 
Xie, Yuan. editor. Cong, Jason. editor. Sapatnekar, Sachin. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-0784-4
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5. 
Cover image for Organic Field Effect Transistors Theory, Fabrication and Characterization
Organic Field Effect Transistors Theory, Fabrication and Characterization
Author 
Kymissis, Ioannis. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-92134-1
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6. 
Cover image for Carbon Nanotube Electronics
Carbon Nanotube Electronics
Author 
Kong, Jing. editor. Javey, Ali. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-69285-2
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7. 
Cover image for Wafer Level 3-D ICs Process Technology
Wafer Level 3-D ICs Process Technology
Author 
Tan, Chuan Seng. editor. Gutmann, Ronald J. editor. Reif, L. Rafael. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-76534-1
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8. 
Cover image for Silicon Analog Components Device Design, Process Integration, Characterization, and Reliability
Silicon Analog Components Device Design, Process Integration, Characterization, and Reliability
Author 
El-Kareh, Badih. author. Hutter, Lou N. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4939-2751-7
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9. 
Cover image for Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability
Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability
Author 
Lee, Tae-Kyu. author. Bieler, Thomas R. author. Kim, Choong-Un. author. Ma, Hongtao. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4614-9266-5
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10. 
Cover image for Carbon Nanotube Based VLSI Interconnects Analysis and Design
Carbon Nanotube Based VLSI Interconnects Analysis and Design
Author 
Kaushik, Brajesh Kumar. author. Majumder, Manoj Kumar. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-81-322-2047-3
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11. 
Cover image for Functional Nanomaterials and Devices for Electronics, Sensors and Energy Harvesting
Functional Nanomaterials and Devices for Electronics, Sensors and Energy Harvesting
Author 
Nazarov, Alexei. editor. Balestra, Francis. editor. Kilchytska, Valeriya. editor. Flandre, Denis. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-08804-4
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12. 
Cover image for High-Efficiency Solar Cells Physics, Materials, and Devices
High-Efficiency Solar Cells Physics, Materials, and Devices
Author 
Wang, Xiaodong. editor. Wang, Zhiming M. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-01988-8
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