Title:
Advanced Materials for Thermal Management of Electronic Packaging
Author:
Tong, Xingcun Colin. author.
ISBN:
9781441977595
Physical Description:
XXII, 618 p. online resource.
Series:
Springer Series in Advanced Microelectronics, 30
Series Title:
Springer Series in Advanced Microelectronics, 1437-0387 ; 30
Added Corporate Author:
Electronic Access:
http://dx.doi.org/10.1007/978-1-4419-7759-5Copies:
Available:*
Library | Material Type | Item Barcode | Shelf Number | Status | Item Holds |
|---|---|---|---|---|---|
Searching... | E-Book | 172970-2001 | ONLINE | Searching... | Searching... |