Solder Joint Reliability Assessment Finite Element Simulation Methodology

Title:

Author:

Tamin, Mohd N. author.

ISBN:

9783319000923

Edition:

1st ed. 2014.

Physical Description:

XIII, 174 p. 119 illus., 55 illus. in color. online resource.

Series:

Advanced Structured Materials, 37

Contents:

Introduction -- Overview of the Simulation Methodology -- Requirements for Finite Element Simulation -- Mechanics of Solder Materials -- Application I: Solder Joint Reflow Process -- Application II: Solder Joints under Temperature and Mechanical Cycles -- Damage Mechanics-based Models -- Application III: Board-level Drop Test with BGA Package -- Fatigue Fracture Process of Solder Joints -- Closure.

Subject Term:

Materials -- Analysis.

Mechanics, Applied.

Solids.

Security systems.

Characterization and Analytical Technique.

Solid Mechanics.

Security Science and Technology.

Added Author:

Shaffiar, Norhashimah M.

Added Corporate Author:

SpringerLink (Online service)