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1. 
Cover image for Fan-Out Wafer-Level Packaging
Fan-Out Wafer-Level Packaging
Author 
Lau, John H. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-10-8884-1
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2. 
Cover image for Gallium Nitride-enabled High Frequency and High Efficiency Power Conversion
Gallium Nitride-enabled High Frequency and High Efficiency Power Conversion
Author 
Meneghesso, Gaudenzio. editor. Meneghini, Matteo. editor. Zanoni, Enrico. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-77994-2
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3. 
Cover image for Solid State Lighting Reliability Part 2 Components to Systems
Solid State Lighting Reliability Part 2 Components to Systems
Author 
van Driel, Willem Dirk. editor. Fan, Xuejun. editor. Zhang, Guo Qi. editor. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-3-319-58175-0
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4. 
Cover image for Electromagnetic Behaviour of Metallic Wire Structures
Electromagnetic Behaviour of Metallic Wire Structures
Author 
Chui, S. T. author. Zhou, Lei. author. SpringerLink (Online service)
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ONLINE(330920.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4471-4159-4
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5. 
Cover image for Sensors An Introductory Course
Sensors An Introductory Course
Author 
Kalantar-zadeh, Kourosh. author. SpringerLink (Online service)
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ONLINE(331661.1)
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http://dx.doi.org/10.1007/978-1-4614-5052-8
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6. 
Cover image for Fundamentals of Nanoscaled Field Effect Transistors
Fundamentals of Nanoscaled Field Effect Transistors
Author 
Chaudhry, Amit. author. SpringerLink (Online service)
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ONLINE(332128.1)
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http://dx.doi.org/10.1007/978-1-4614-6822-6
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7. 
Cover image for High Mobility and Quantum Well Transistors Design and TCAD Simulation
High Mobility and Quantum Well Transistors Design and TCAD Simulation
Author 
Hellings, Geert. author. De Meyer, Kristin. author. SpringerLink (Online service)
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ONLINE(336218.1)
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http://dx.doi.org/10.1007/978-94-007-6340-1
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8. 
Cover image for Solid State Lighting Reliability Components to Systems
Solid State Lighting Reliability Components to Systems
Author 
van Driel, W.D. editor. Fan, X.J. editor. SpringerLink (Online service)
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ONLINE(331314.1)
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http://dx.doi.org/10.1007/978-1-4614-3067-4
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9. 
Cover image for Applications of Organic and Printed Electronics A Technology-Enabled Revolution
Applications of Organic and Printed Electronics A Technology-Enabled Revolution
Author 
Cantatore, Eugenio. editor. SpringerLink (Online service)
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ONLINE(331320.1)
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http://dx.doi.org/10.1007/978-1-4614-3160-2
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10. 
Cover image for Advanced Flip Chip Packaging
Advanced Flip Chip Packaging
Author 
Tong, Ho-Ming. editor. Lai, Yi-Shao. editor. Wong, C.P. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(330808.1)
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http://dx.doi.org/10.1007/978-1-4419-5768-9
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11. 
Cover image for Tuneable Film Bulk Acoustic Wave Resonators
Tuneable Film Bulk Acoustic Wave Resonators
Author 
Gevorgian, Spartak Sh. author. Tagantsev, Alexander K. author. Vorobiev, Andrei K. author. SpringerLink (Online service)
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ONLINE(331105.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4471-4944-6
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12. 
Cover image for Lead Free Solder Mechanics and Reliability
Lead Free Solder Mechanics and Reliability
Author 
Pang, John Hock Lye. author. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/978-1-4614-0463-7
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