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Cover image for 3rd International Conference on Advanced Joining Processes 2023 Selected Contributions of AJP 2023
3rd International Conference on Advanced Joining Processes 2023 Selected Contributions of AJP 2023
Author 
da Silva, Lucas F. M. editor. Martins, Paulo. editor. (orcid)0000-0002-2630-4593 Reisgen, Uwe. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-54732-4
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2. 
Cover image for Powder Consolidation Using Cold Spray Process Modeling and Emerging Applications
Powder Consolidation Using Cold Spray Process Modeling and Emerging Applications
Author 
Moridi, Atieh. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-29962-4
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3. 
Cover image for Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces
Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces
Author 
Zhang, Qingke. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-662-48823-2
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4. 
Cover image for Crystallographic Texture of Materials
Crystallographic Texture of Materials
Author 
Suwas, Satyam. author. Ray, Ranjit Kumar. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4471-6314-5
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