Cover image for Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect
Title:
Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect
Author:
Cheng, Jie. author.
ISBN:
9789811061653
Edition:
1st ed. 2018.
Physical Description:
XVIII, 137 p. 103 illus. online resource.
Series:
Springer Theses, Recognizing Outstanding Ph.D. Research,
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