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1. 
Cover image for Nanoscaled Semiconductor-on-Insulator Structures and Devices
Nanoscaled Semiconductor-on-Insulator Structures and Devices
Author 
Hall, Steve. editor. Nazarov, Alexei N. editor. Lysenko, Vladimir S. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4020-6380-0
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2. 
Cover image for Extrusion in Ceramics
Extrusion in Ceramics
Author 
Händle, Frank. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-27102-4
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3. 
Cover image for Theory of Defects in Semiconductors
Theory of Defects in Semiconductors
Author 
Drabold, David A. editor. Estreicher, Stefan K. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/11690320
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4. 
Cover image for Light Scattering in Solid IX
Light Scattering in Solid IX
Author 
Cardona, Manuel. editor. Merlin, Roberto. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/b14231
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5. 
Cover image for CMOS Hotplate Chemical Microsensors
CMOS Hotplate Chemical Microsensors
Author 
Graf, Markus. author. Barrettino, Diego. author. Baltes, Henry P. author. Hierlemann, Andreas. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-69562-2
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6. 
Cover image for Data Converters
Data Converters
Author 
Maloberti, Franco. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-32486-9
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7. 
Cover image for Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Author 
Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/0-387-32989-7
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8. 
Cover image for Lead-Free Electronic Solders A Special Issue of the Journal of Materials Science: Materials in Electronics
Lead-Free Electronic Solders A Special Issue of the Journal of Materials Science: Materials in Electronics
Author 
Subramanian, K. N. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-48433-4
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9. 
Cover image for Basic Electromagnetism and Materials
Basic Electromagnetism and Materials
Author 
Moliton, André. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-49368-8
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10. 
Cover image for Lead-Free Soldering
Lead-Free Soldering
Author 
Bath, Jasbir. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-68422-2
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11. 
Cover image for Handbook of High-Temperature Superconductivity Theory and Experiment
Handbook of High-Temperature Superconductivity Theory and Experiment
Author 
Schrieffer, J. Robert. editor. Brooks, James S. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-68734-6
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12. 
Cover image for Nanocomposites Ionic Conducting Materials and Structural Spectroscopies
Nanocomposites Ionic Conducting Materials and Structural Spectroscopies
Author 
Knauth, Philippe. editor. Schoonman, Joop. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-68907-4
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