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1. 
Cover image for Electromechanical Systems in Microtechnology and Mechatronics Electrical, Mechanical and Acoustic Networks, their Interactions and Applications
Electromechanical Systems in Microtechnology and Mechatronics Electrical, Mechanical and Acoustic Networks, their Interactions and Applications
Author 
Lenk, Arno. author. Ballas, Rüdiger G. author. Werthschützky, Roland. author. Pfeifer, Günther. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-10806-8
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2. 
Cover image for Reliability of Microtechnology Interconnects, Devices and Systems
Reliability of Microtechnology Interconnects, Devices and Systems
Author 
Liu, Johan. author. Salmela, Olli. author. Sarkka, Jussi. author. Morris, James E. author. Tegehall, Per-Erik. author.
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-5760-3
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3. 
Cover image for Surface Tension in Microsystems Engineering Below the Capillary Length
Surface Tension in Microsystems Engineering Below the Capillary Length
Author 
Lambert, Pierre. editor. SpringerLink (Online service)
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ONLINE(334451.1)
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-37552-1
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4. 
Cover image for Piezotronics and Piezo-Phototronics
Piezotronics and Piezo-Phototronics
Author 
Wang, Zhong Lin. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-34237-0
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5. 
Cover image for Design and Manufacturing of Active Microsystems
Design and Manufacturing of Active Microsystems
Author 
Büttgenbach, Stephanus. editor. Burisch, Arne. editor. Hesselbach, Jürgen. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-12903-2
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6. 
Cover image for Piezoceramic Sensors
Piezoceramic Sensors
Author 
Sharapov, Valeriy. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-15311-2
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7. 
Cover image for Thermal Transport for Applications in Micro/Nanomachining
Thermal Transport for Applications in Micro/Nanomachining
Author 
Wong, Basil T. author. Mengüç, M. Pinar. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-540-73607-3
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8. 
Cover image for Capillary Forces in Microassembly Modeling, Simulation, Experiments, and Case Study
Capillary Forces in Microassembly Modeling, Simulation, Experiments, and Case Study
Author 
Lambert, Pierre. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-71089-1
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9. 
Cover image for CMOS Hotplate Chemical Microsensors
CMOS Hotplate Chemical Microsensors
Author 
Graf, Markus. author. Barrettino, Diego. author. Baltes, Henry P. author. Hierlemann, Andreas. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-540-69562-2
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10. 
Cover image for Piezoelectric Multilayer Beam Bending Actuators Static and Dynamic Behavior and Aspects of Sensor Integration
Piezoelectric Multilayer Beam Bending Actuators Static and Dynamic Behavior and Aspects of Sensor Integration
Author 
Ballas, Rüdiger G. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-540-32642-7
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11. 
Cover image for Micromechanical Photonics
Micromechanical Photonics
Author 
Ukita, Hiroo. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-540-31372-4
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12. 
Cover image for Integrated Chemical Microsensor Systems in CMOS Technology
Integrated Chemical Microsensor Systems in CMOS Technology
Author 
Hierlemann, Andreas. author. Baltes, H. editor. Fujita, Hiroyuki. editor. Liepmann, Dorian. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/b138987
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