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1. 
Cover image for Frontiers of Ferroelectricity A Special Issue of the Journal of Materials Science
Frontiers of Ferroelectricity A Special Issue of the Journal of Materials Science
Author 
Lang, Sidney B. author. Chan, Helen L. W. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-38039-1
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2. 
Cover image for Solder Joint Technology Materials, Properties, and Reliability
Solder Joint Technology Materials, Properties, and Reliability
Author 
Tu, King-Ning. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-38892-2
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3. 
Cover image for Lead-Free Electronic Solders A Special Issue of the Journal of Materials Science: Materials in Electronics
Lead-Free Electronic Solders A Special Issue of the Journal of Materials Science: Materials in Electronics
Author 
Subramanian, K. N. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-48433-4
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4. 
Cover image for Wide Bandgap Semiconductors Fundamental Properties and Modern Photonic and Electronic Devices
Wide Bandgap Semiconductors Fundamental Properties and Modern Photonic and Electronic Devices
Author 
Takahashi, Kiyoshi. editor. Yoshikawa, Akihiko. editor. Sandhu, Adarsh. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-540-47235-3
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5. 
Cover image for Piezoelectric Multilayer Beam Bending Actuators Static and Dynamic Behavior and Aspects of Sensor Integration
Piezoelectric Multilayer Beam Bending Actuators Static and Dynamic Behavior and Aspects of Sensor Integration
Author 
Ballas, Rüdiger G. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-540-32642-7
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6. 
Cover image for Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Author 
Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/0-387-32989-7
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7. 
Cover image for Nanotechnology for Electronic Materials and Devices
Nanotechnology for Electronic Materials and Devices
Author 
Korkin, Anatoli. editor. Gusev, Evgeni. editor. Labanowski, Jan. editor. Luryi, Serge. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-49965-9
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8. 
Cover image for Lead-Free Soldering
Lead-Free Soldering
Author 
Bath, Jasbir. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-68422-2
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9. 
Cover image for A Guide to Lead-free Solders Physical Metallurgy and Reliability
A Guide to Lead-free Solders Physical Metallurgy and Reliability
Author 
Evans, John W. author. Engelmaier, Werner. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-84628-310-9
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10. 
Cover image for Simulation of Semiconductor Processes and Devices 2007 SISPAD 2007
Simulation of Semiconductor Processes and Devices 2007 SISPAD 2007
Author 
Grasser, Tibor. editor. Selberherr, Siegfried. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-211-72861-1
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11. 
Cover image for Springer Handbook of Electronic and Photonic Materials
Springer Handbook of Electronic and Photonic Materials
Author 
Kasap, Safa. editor. Capper, Peter. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-29185-7
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12. 
Cover image for Data Converters
Data Converters
Author 
Maloberti, Franco. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-32486-9
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