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1. 
Cover image for An Introduction to the Mathematical Theory of Dynamic Materials
An Introduction to the Mathematical Theory of Dynamic Materials
Author 
Lurie, Konstantin A. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/0-387-38280-1
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2. 
Cover image for Solder Joint Technology Materials, Properties, and Reliability
Solder Joint Technology Materials, Properties, and Reliability
Author 
Tu, King-Ning. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-38892-2
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3. 
Cover image for Ceramic Materials Science and Engineering
Ceramic Materials Science and Engineering
Author 
Carter, C. Barry. author. Norton, M. Grant. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-46271-4
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4. 
Cover image for Lead-Free Soldering
Lead-Free Soldering
Author 
Bath, Jasbir. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-68422-2
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5. 
Cover image for Nanocomposites Ionic Conducting Materials and Structural Spectroscopies
Nanocomposites Ionic Conducting Materials and Structural Spectroscopies
Author 
Knauth, Philippe. editor. Schoonman, Joop. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-68907-4
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6. 
Cover image for A Guide to Lead-free Solders Physical Metallurgy and Reliability
A Guide to Lead-free Solders Physical Metallurgy and Reliability
Author 
Evans, John W. author. Engelmaier, Werner. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-84628-310-9
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7. 
Cover image for Plasmonics: Fundamentals and Applications
Plasmonics: Fundamentals and Applications
Author 
Maier, Stefan A. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/0-387-37825-1
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8. 
Cover image for Lead-Free Electronic Solders A Special Issue of the Journal of Materials Science: Materials in Electronics
Lead-Free Electronic Solders A Special Issue of the Journal of Materials Science: Materials in Electronics
Author 
Subramanian, K. N. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-48433-4
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9. 
Cover image for Materials Chemistry
Materials Chemistry
Author 
Fahlman, Bradley D. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4020-6120-2
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