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1. 
Cover image for Multifunctional Polycrystalline Ferroelectric Materials Processing and Properties
Multifunctional Polycrystalline Ferroelectric Materials Processing and Properties
Author 
Pardo, Lorena. author. Ricote, Jesús. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-90-481-2875-4
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2. 
Cover image for Swift Heavy Ions for Materials Engineering and Nanostructuring
Swift Heavy Ions for Materials Engineering and Nanostructuring
Author 
Avasthi, D. K. author. Mehta, G. K. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-94-007-1229-4
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3. 
Cover image for Device Architecture and Materials for Organic Light-Emitting Devices Targeting High Current Densities and Control of the Triplet Concentration
Device Architecture and Materials for Organic Light-Emitting Devices Targeting High Current Densities and Control of the Triplet Concentration
Author 
Schols, Sarah. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-94-007-1608-7
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4. 
Cover image for Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections
Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections
Author 
Tan, Cher Ming. author. Li, Wei. author. Gan, Zhenghao. author. Hou, Yuejin. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-85729-310-7
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5. 
Cover image for Impact of Nonlinearities on Fiber Optic Communications
Impact of Nonlinearities on Fiber Optic Communications
Author 
Kumar, Shiva. editor. SpringerLink (Online service)
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Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-8139-4
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6. 
Cover image for Characterization of Terahertz Emission from High Resistivity Fe-doped Bulk Ga0.69In0.31As Based Photoconducting Antennas
Characterization of Terahertz Emission from High Resistivity Fe-doped Bulk Ga0.69In0.31As Based Photoconducting Antennas
Author 
Sengupta, Suranjana. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-8198-1
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7. 
Cover image for Advanced Materials for Thermal Management of Electronic Packaging
Advanced Materials for Thermal Management of Electronic Packaging
Author 
Tong, Xingcun Colin. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-7759-5
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8. 
Cover image for Tip-Based Nanofabrication Fundamentals and Applications
Tip-Based Nanofabrication Fundamentals and Applications
Author 
Tseng, Ampere A. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-9899-6
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9. 
Cover image for Introduction to the Physics of Electrons in Solids
Introduction to the Physics of Electrons in Solids
Author 
Alloul, Henri. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-13565-1
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10. 
Cover image for Terahertz Technology Fundamentals and Applications
Terahertz Technology Fundamentals and Applications
Author 
Rostami, Ali. author. Rasooli, Hassan. author. Baghban, Hamed. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-15793-6
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11. 
Cover image for Fundamentals of Superconducting Nanoelectronics
Fundamentals of Superconducting Nanoelectronics
Author 
Sidorenko, Anatolie. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-20158-5
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12. 
Cover image for Handbook of Transparent Conductors
Handbook of Transparent Conductors
Author 
Ginley, David S. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-1638-9
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