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1. 
Cover image for New Directions in Thin Film Nanophotonics
New Directions in Thin Film Nanophotonics
Author 
K. V., Sreekanth. author. ElKabbash, Mohamed. author. Caligiuri, Vincenzo. author. Singh, Ranjan. author. De Luca, Antonio. author.
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https://doi.org/10.1007/978-981-13-8891-0
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Cover image for Challenges in Mechanics of Time Dependent Materials, Volume 2 Proceedings of the 2017 Annual Conference on Experimental and Applied Mechanics
Challenges in Mechanics of Time Dependent Materials, Volume 2 Proceedings of the 2017 Annual Conference on Experimental and Applied Mechanics
Author 
Arzoumanidis, Alex. editor. Silberstein, Meredith. editor. Amirkhizi, Alireza. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-63393-0
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3. 
Cover image for Unified Strength Theory and Its Applications
Unified Strength Theory and Its Applications
Author 
Yu, Mao-Hong. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-10-6247-6
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4. 
Cover image for Magnetostatic Modelling of Thin Layers Using the Method of Moments And Its Implementation in OCTAVE/MATLAB
Magnetostatic Modelling of Thin Layers Using the Method of Moments And Its Implementation in OCTAVE/MATLAB
Author 
Szewczyk, Roman. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-77985-0
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5. 
Cover image for Fracture Mechanics With an Introduction to Micromechanics
Fracture Mechanics With an Introduction to Micromechanics
Author 
Gross, Dietmar. author. Seelig, Thomas. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-71090-7
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6. 
Cover image for Wave Propagation and Diffraction Mathematical Methods and Applications
Wave Propagation and Diffraction Mathematical Methods and Applications
Author 
Selezov, Igor T. author. Kryvonos, Yuriy G. author. Gandzha, Ivan S. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-10-4923-1
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7. 
Cover image for Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
Author 
Seok, Seonho. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-77872-3
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8. 
Cover image for Basics of Continuum Plasticity
Basics of Continuum Plasticity
Author 
Chung, Kwansoo. author. Lee, Myoung-Gyu. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-10-8306-8
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9. 
Cover image for Contact Modeling for Solids and Particles
Contact Modeling for Solids and Particles
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Popp, Alexander. editor. Wriggers, Peter. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-90155-8
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10. 
Cover image for Advanced Ceramic and Metallic Coating and Thin Film Materials for Energy and Environmental Applications
Advanced Ceramic and Metallic Coating and Thin Film Materials for Energy and Environmental Applications
Author 
Zhang, Jing. editor. Jung, Yeon-Gil. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-59906-9
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11. 
Cover image for Micromechanics and Nanomechanics of Composite Solids
Micromechanics and Nanomechanics of Composite Solids
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Meguid, Shaker A. editor. Weng, George J. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-52794-9
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12. 
Cover image for Advancement of Optical Methods in Experimental Mechanics, Volume 3 Proceedings of the 2017 Annual Conference on Experimental and Applied Mechanics
Advancement of Optical Methods in Experimental Mechanics, Volume 3 Proceedings of the 2017 Annual Conference on Experimental and Applied Mechanics
Author 
Lamberti, Luciano. editor. Lin, Ming-Tzer. editor. Furlong, Cosme. editor. Sciammarella, Cesar. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-63028-1
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