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1. 
Cover image for Light-Emitting Diodes Materials, Processes, Devices and Applications
Light-Emitting Diodes Materials, Processes, Devices and Applications
Author 
Li, Jinmin. editor. Zhang, G. Q. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-99211-2
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2. 
Cover image for Bias Temperature Instability for Devices and Circuits
Bias Temperature Instability for Devices and Circuits
Author 
Grasser, Tibor. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4614-7909-3
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3. 
Cover image for Trace-Based Post-Silicon Validation for VLSI Circuits
Trace-Based Post-Silicon Validation for VLSI Circuits
Author 
Liu, Xiao. author. Xu, Qiang. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-00533-1
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4. 
Cover image for Semiconductor Technologies in the Era of Electronics
Semiconductor Technologies in the Era of Electronics
Author 
Kang, Yong Hoon. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-94-017-8768-0
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5. 
Cover image for Reliability of High Mobility SiGe Channel MOSFETs for Future CMOS Applications
Reliability of High Mobility SiGe Channel MOSFETs for Future CMOS Applications
Author 
Franco, Jacopo. author. Kaczer, Ben. author. Groeseneken, Guido. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-94-007-7663-0
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6. 
Cover image for Energy-Efficient Fault-Tolerant Systems
Energy-Efficient Fault-Tolerant Systems
Author 
Mathew, Jimson. editor. Shafik, Rishad A. editor. Pradhan, Dhiraj K. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4614-4193-9
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7. 
Cover image for Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs
Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs
Author 
Noia, Brandon. author. Chakrabarty, Krishnendu. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-02378-6
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8. 
Cover image for Exploring Memory Hierarchy Design with Emerging Memory Technologies
Exploring Memory Hierarchy Design with Emerging Memory Technologies
Author 
Sun, Guangyu. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-00681-9
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9. 
Cover image for MOSFET Technologies for Double-Pole Four-Throw Radio-Frequency Switch
MOSFET Technologies for Double-Pole Four-Throw Radio-Frequency Switch
Author 
Srivastava, Viranjay M. author. Singh, Ghanshyam. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-01165-3
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10. 
Cover image for Flash Memories Economic Principles of Performance, Cost and Reliability Optimization
Flash Memories Economic Principles of Performance, Cost and Reliability Optimization
Author 
Richter, Detlev. author. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-94-007-6082-0
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11. 
Cover image for Introduction to Thin Film Transistors Physics and Technology of TFTs
Introduction to Thin Film Transistors Physics and Technology of TFTs
Author 
Brotherton, S.D. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(332657.1)
Electronic Access 
http://dx.doi.org/10.1007/978-3-319-00002-2
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12. 
Cover image for High-Performance D/A-Converters Application to Digital Transceivers
High-Performance D/A-Converters Application to Digital Transceivers
Author 
Clara, Martin. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(333409.1)
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-31229-8
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