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1. 
Cover image for Electronic Properties of Materials
Electronic Properties of Materials
Author 
Hummel, Rolf E. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-8164-6
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Cover image for Electronic Structure of Strongly Correlated Materials
Electronic Structure of Strongly Correlated Materials
Author 
Anisimov, Vladimir. author. Izyumov, Yuri. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-04826-5
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3. 
Cover image for Nanotechnology for Electronic Materials and Devices
Nanotechnology for Electronic Materials and Devices
Author 
Korkin, Anatoli. editor. Gusev, Evgeni. editor. Labanowski, Jan. editor. Luryi, Serge. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-49965-9
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4. 
Cover image for Springer Handbook of Electronic and Photonic Materials
Springer Handbook of Electronic and Photonic Materials
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Kasap, Safa. editor. Capper, Peter. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-29185-7
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5. 
Cover image for Theory of Charge Transport in Carbon Electronic Materials
Theory of Charge Transport in Carbon Electronic Materials
Author 
Shuai, Zhigang. author. Wang, Linjun. author. Song, Chenchen. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-25076-7
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6. 
Cover image for Advanced Materials for Thermal Management of Electronic Packaging
Advanced Materials for Thermal Management of Electronic Packaging
Author 
Tong, Xingcun Colin. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-7759-5
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7. 
Cover image for Lock-in Thermography Basics and Use for Evaluating Electronic Devices and Materials
Lock-in Thermography Basics and Use for Evaluating Electronic Devices and Materials
Author 
Breitenstein, Otwin. author. Warta, Wilhelm. author. Langenkamp, Martin. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-02417-7
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8. 
Cover image for Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Author 
Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/0-387-32989-7
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9. 
Cover image for Lead-Free Electronic Solders A Special Issue of the Journal of Materials Science: Materials in Electronics
Lead-Free Electronic Solders A Special Issue of the Journal of Materials Science: Materials in Electronics
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Subramanian, K. N. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-48433-4
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10. 
Cover image for Physics of Negative Refraction and Negative Index Materials Optical and Electronic Aspects and Diversified Approaches
Physics of Negative Refraction and Negative Index Materials Optical and Electronic Aspects and Diversified Approaches
Author 
Krowne, Clifford M. editor. Zhang, Yong. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-72132-1
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11. 
Cover image for Photoelectrochemical Hydrogen Production
Photoelectrochemical Hydrogen Production
Author 
van de Krol, Roel. editor. Grätzel, Michael. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4614-1380-6
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12. 
Cover image for Flexible Electronics Materials and Applications
Flexible Electronics Materials and Applications
Author 
Salleo, Alberto. editor. Wong, William S. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-74363-9
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