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1. 
Cover image for Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
Author 
Seok, Seonho. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-77872-3
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2. 
Cover image for Control and Automation, and Energy System Engineering International Conferences, CA and CES3 2011, Held as Part of the Future Generation Information Technology Conference, FGIT 2011, in Conjunction with GDC 2011, Jeju Island, Korea, December 8-10, 2011. Proceedings
Control and Automation, and Energy System Engineering International Conferences, CA and CES3 2011, Held as Part of the Future Generation Information Technology Conference, FGIT 2011, in Conjunction with GDC 2011, Jeju Island, Korea, December 8-10, 2011. Proceedings
Author 
Kim, Tai-hoon. editor. Adeli, Hojjat. editor. Stoica, Adrian. editor. Kang, Byeong-Ho. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-26010-0
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3. 
Cover image for Metaverse - METAVERSE 2023 19th International Conference, Held as Part of the Services Conference Federation, SCF 2023, Honolulu, HI, USA, September 23-26, 2023, Proceedings
Metaverse - METAVERSE 2023 19th International Conference, Held as Part of the Services Conference Federation, SCF 2023, Honolulu, HI, USA, September 23-26, 2023, Proceedings
Author 
He, Sheng. editor. Lai, Jiacai. editor. Zhang, Liang-Jie. editor. (orcid) SpringerLink (Online service)
Preferred Shelf Number 
XX(521176.1)
Electronic Access 
https://doi.org/10.1007/978-3-031-44754-9
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4. 
Cover image for Computer Science and Education 17th International Conference, ICCSE 2022, Ningbo, China, August 18-21, 2022, Revised Selected Papers, Part III
Computer Science and Education 17th International Conference, ICCSE 2022, Ningbo, China, August 18-21, 2022, Revised Selected Papers, Part III
Author 
Hong, Wenxing. editor. Weng, Yang. editor. SpringerLink (Online service)
Preferred Shelf Number 
XX(520246.1)
Electronic Access 
https://doi.org/10.1007/978-981-99-2449-3
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5. 
Cover image for Advanced Hybrid Information Processing 6th EAI International Conference, ADHIP 2022, Changsha, China, September 29-30, 2022, Proceedings, Part I
Advanced Hybrid Information Processing 6th EAI International Conference, ADHIP 2022, Changsha, China, September 29-30, 2022, Proceedings, Part I
Author 
Fu, Weina. editor. Yun, Lin. editor. SpringerLink (Online service)
Preferred Shelf Number 
XX(520370.1)
Electronic Access 
https://doi.org/10.1007/978-3-031-28787-9
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6. 
Cover image for Sustainable Computing Transforming Industry 4.0 to Society 5.0
Sustainable Computing Transforming Industry 4.0 to Society 5.0
Author 
Awasthi, Shashank. editor. Sanyal, Goutam. editor. Travieso-Gonzalez, Carlos M. editor. Kumar Srivastava, Pramod. editor. Singh, Dinesh Kumar. editor.
Preferred Shelf Number 
XX(520751.1)
Electronic Access 
https://doi.org/10.1007/978-3-031-13577-4
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7. 
Cover image for Closed Power Cycles Thermodynamic Fundamentals and Applications
Closed Power Cycles Thermodynamic Fundamentals and Applications
Author 
Invernizzi, Costante Mario. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(331155.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4471-5140-1
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