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1. 
Cover image for Mechanics of Microelectronics
Mechanics of Microelectronics
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Zhang, G. Q. editor. Driel, W. D. editor. Fan, X. J. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/1-4020-4935-8
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Cover image for RF and Microwave Microelectronics Packaging
RF and Microwave Microelectronics Packaging
Author 
Kuang, Ken. editor. Kim, Franklin. editor. Cahill, Sean S. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-0984-8
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Cover image for Heteromagnetic Microelectronics Microsystems of Active Type
Heteromagnetic Microelectronics Microsystems of Active Type
Author 
Ignatiev, Alexander A. author. Lyashenko, Alexander V. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-6002-3
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4. 
Cover image for Field Emission in Vacuum Microelectronics
Field Emission in Vacuum Microelectronics
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Fursey, George. author. Brodie, Ivor. editor. Schwoebel, Paul. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/b139052
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5. 
Cover image for Proceedings of the Third International Conference on Microelectronics, Computing and Communication Systems MCCS 2018
Proceedings of the Third International Conference on Microelectronics, Computing and Communication Systems MCCS 2018
Author 
Nath, Vijay. editor. Mandal, Jyotsna Kumar. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-13-7091-5
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6. 
Cover image for Proceeding of the Second International Conference on Microelectronics, Computing & Communication Systems (MCCS 2017)
Proceeding of the Second International Conference on Microelectronics, Computing & Communication Systems (MCCS 2017)
Author 
Nath, Vijay. editor. Mandal, Jyotsna Kumar. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-10-8234-4
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7. 
Cover image for Microelectronics, Electromagnetics and Telecommunications Proceedings of the Fourth ICMEET 2018
Microelectronics, Electromagnetics and Telecommunications Proceedings of the Fourth ICMEET 2018
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Panda, Ganapati. editor. Satapathy, Suresh Chandra. editor. Biswal, Birendra. editor. Bansal, Ramesh. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-13-1906-8
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8. 
Cover image for Microelectronics, Electromagnetics and Telecommunications Proceedings of ICMEET 2017
Microelectronics, Electromagnetics and Telecommunications Proceedings of ICMEET 2017
Author 
Anguera, Jaume. editor. Satapathy, Suresh Chandra. editor. Bhateja, Vikrant. editor. Sunitha, K.V.N. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-10-7329-8
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9. 
Cover image for Proceedings of the International Conference on Microelectronics, Computing & Communication Systems MCCS 2015
Proceedings of the International Conference on Microelectronics, Computing & Communication Systems MCCS 2015
Author 
Nath, Vijay. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-10-5565-2
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10. 
Cover image for Proceedings of 2nd International Conference on Micro-Electronics, Electromagnetics and Telecommunications ICMEET 2016
Proceedings of 2nd International Conference on Micro-Electronics, Electromagnetics and Telecommunications ICMEET 2016
Author 
Satapathy, Suresh Chandra. editor. Bhateja, Vikrant. editor. Chowdary, P. Satish Rama. editor. Chakravarthy, V.V.S.S. Sameer. editor. Anguera, Jaume. editor.
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https://doi.org/10.1007/978-981-10-4280-5
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11. 
Cover image for Interfacial Compatibility in Microelectronics Moving Away from the Trial and Error Approach
Interfacial Compatibility in Microelectronics Moving Away from the Trial and Error Approach
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Laurila, Tomi. author. Vuorinen, Vesa. author. Paulasto-Kröckel, Mervi. author. Turunen, Markus. author. Mattila, Toni T. author.
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http://dx.doi.org/10.1007/978-1-4471-2470-2
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12. 
Cover image for Emerging Topics in Heat and Mass Transfer in Porous Media From Bioengineering and Microelectronics to Nanotechnology
Emerging Topics in Heat and Mass Transfer in Porous Media From Bioengineering and Microelectronics to Nanotechnology
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Vadász, Peter. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4020-8178-1
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