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1. 
Cover image for Microstructure and Properties of High-Temperature Superconductors
Microstructure and Properties of High-Temperature Superconductors
Author 
Parinov, I. A. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-34441-1
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2. 
Cover image for Fundamentals of Piezoelectric Sensorics Mechanical, Dielectric, and Thermodynamical Properties of Piezoelectric Materials
Fundamentals of Piezoelectric Sensorics Mechanical, Dielectric, and Thermodynamical Properties of Piezoelectric Materials
Author 
Tichý, Jan. author. Erhart, Jiří. author. Kittinger, Erwin. author. Přívratská, Jana. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-68427-5
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3. 
Cover image for Case Studies in Superconducting Magnets Design and Operational Issues
Case Studies in Superconducting Magnets Design and Operational Issues
Author 
Iwasa, Yukikazu. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/b112047
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4. 
Cover image for A Guide to Lead-free Solders Physical Metallurgy and Reliability
A Guide to Lead-free Solders Physical Metallurgy and Reliability
Author 
Evans, John W. author. Engelmaier, Werner. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-84628-310-9
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5. 
Cover image for Lead-Free Electronic Solders A Special Issue of the Journal of Materials Science: Materials in Electronics
Lead-Free Electronic Solders A Special Issue of the Journal of Materials Science: Materials in Electronics
Author 
Subramanian, K. N. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-48433-4
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6. 
Cover image for MEMS/NEMS Handbook Techniques and Applications
MEMS/NEMS Handbook Techniques and Applications
Author 
Leondes, Cornelius T. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/b136111
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