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1. 
Cover image for Advanced Noncontact Cutting and Joining Technologies Micro- and Nano-manufacturing
Advanced Noncontact Cutting and Joining Technologies Micro- and Nano-manufacturing
Author 
Mahamood, Rasheedat Modupe. author. Akinlabi, Esther Titilayo. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-75118-4
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2. 
Cover image for Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
Author 
Seok, Seonho. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-77872-3
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3. 
Cover image for Electrohydrodynamic Direct-Writing for Flexible Electronic Manufacturing
Electrohydrodynamic Direct-Writing for Flexible Electronic Manufacturing
Author 
Yin, Zhouping. author. Huang, Yongan. author. Duan, Yongqing. author. Zhang, Haitao. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-10-4759-6
Format: 
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Online Library~1
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