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1. 
Cover image for Factors Governing Tin Whisker Growth
Factors Governing Tin Whisker Growth
Author 
Crandall, Erika R. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(332756.1)
Electronic Access 
http://dx.doi.org/10.1007/978-3-319-00470-9
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2. 
Cover image for MEMS Materials and Processes Handbook
MEMS Materials and Processes Handbook
Author 
Ghodssi, Reza. editor. Lin, Pinyen. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-47318-5
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3. 
Cover image for Introductory MEMS Fabrication and Applications
Introductory MEMS Fabrication and Applications
Author 
Adams, Thomas M. author. Layton, Richard A. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-09511-0
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4. 
Cover image for Micromachined Thin-Film Sensors for SOI-CMOS Co-Integration
Micromachined Thin-Film Sensors for SOI-CMOS Co-Integration
Author 
Laconte, J. author. Flandre, D. author. Raskin, J. -P. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/0-387-28843-0
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5. 
Cover image for Physik der Halbleiterbauelemente Einführendes Lehrbuch für Ingenieure und Physiker
Physik der Halbleiterbauelemente Einführendes Lehrbuch für Ingenieure und Physiker
Author 
Thuselt, Frank. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/b138004
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