Title:
Fan-Out Wafer-Level Packaging
Author:
Lau, John H. author.
ISBN:
9789811088841
Edition:
1st ed. 2018.
Physical Description:
XX, 303 p. 278 illus., 226 illus. in color. online resource.
Added Corporate Author:
Electronic Access:
https://doi.org/10.1007/978-981-10-8884-1Copies:
Available:*
Library | Material Type | Item Barcode | Shelf Number | Status | Item Holds |
|---|---|---|---|---|---|
Searching... | E-Book | 399728-1001 | ONLINE | Searching... | Searching... |