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2013
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1. 
Cover image for Advanced Flip Chip Packaging
Advanced Flip Chip Packaging
Author 
Tong, Ho-Ming. editor. Lai, Yi-Shao. editor. Wong, C.P. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(330808.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-5768-9
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2. 
Cover image for Solid State Lighting Reliability Components to Systems
Solid State Lighting Reliability Components to Systems
Author 
van Driel, W.D. editor. Fan, X.J. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(331314.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-3067-4
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3. 
Cover image for Sensors An Introductory Course
Sensors An Introductory Course
Author 
Kalantar-zadeh, Kourosh. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(331661.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-5052-8
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4. 
Cover image for Fundamentals of Nanoscaled Field Effect Transistors
Fundamentals of Nanoscaled Field Effect Transistors
Author 
Chaudhry, Amit. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(332128.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-6822-6
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