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1. 
Cover image for Advanced Flip Chip Packaging
Advanced Flip Chip Packaging
Author 
Tong, Ho-Ming. editor. Lai, Yi-Shao. editor. Wong, C.P. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(330808.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-5768-9
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2. 
Cover image for Solid State Lighting Reliability Components to Systems
Solid State Lighting Reliability Components to Systems
Author 
van Driel, W.D. editor. Fan, X.J. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(331314.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-3067-4
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3. 
Cover image for Sensors An Introductory Course
Sensors An Introductory Course
Author 
Kalantar-zadeh, Kourosh. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(331661.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-5052-8
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4. 
Cover image for Fundamentals of Nanoscaled Field Effect Transistors
Fundamentals of Nanoscaled Field Effect Transistors
Author 
Chaudhry, Amit. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(332128.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-6822-6
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5. 
Cover image for Lead Free Solder Mechanics and Reliability
Lead Free Solder Mechanics and Reliability
Author 
Pang, John Hock Lye. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-0463-7
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6. 
Cover image for Microelectronic Test Structures for CMOS Technology
Microelectronic Test Structures for CMOS Technology
Author 
Bhushan, Manjul. author. Ketchen, Mark B. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-9377-9
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7. 
Cover image for Cellular Nanoscale Sensory Wave Computing
Cellular Nanoscale Sensory Wave Computing
Author 
Baatar, Chagaan. editor. Porod, Wolfgang. editor. Roska, Tamás. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-1011-0
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8. 
Cover image for Electrical Conductive Adhesives with Nanotechnologies
Electrical Conductive Adhesives with Nanotechnologies
Author 
Li, Yi. author. Lu, Daniel. author. Wong, C. P. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-88783-8
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9. 
Cover image for Copper Interconnect Technology
Copper Interconnect Technology
Author 
Gupta, Tapan. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-0076-0
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10. 
Cover image for Memories in Wireless Systems
Memories in Wireless Systems
Author 
Micheloni, Rino. editor. Campardo, Giovanni. editor. Olivo, Piero. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-540-79078-5
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11. 
Cover image for Polarization Effects in Semiconductors From Ab InitioTheory to Device Applications
Polarization Effects in Semiconductors From Ab InitioTheory to Device Applications
Author 
Wood, Colin. editor. Jena, Debdeep. editor. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/978-0-387-68319-5
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12. 
Cover image for Physical Limitations of Semiconductor Devices
Physical Limitations of Semiconductor Devices
Author 
Vashchenko, V. A. author. Sinkevitch, V. F. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-74514-5
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