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1. 
Cover image for Electrical Conductive Adhesives with Nanotechnologies
Electrical Conductive Adhesives with Nanotechnologies
Author 
Li, Yi. author. Lu, Daniel. author. Wong, C. P. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-88783-8
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2. 
Cover image for Carbon Nanotube Electronics
Carbon Nanotube Electronics
Author 
Kong, Jing. editor. Javey, Ali. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-69285-2
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3. 
Cover image for Copper Interconnect Technology
Copper Interconnect Technology
Author 
Gupta, Tapan. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-0076-0
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